SET – NEO HB
NEO HB is a flip-chip bonder designed for ± 1 µm @ 3σ accuracy in stand-alone or full automatic mode (EFEM). It is suitable for Hybrid/Direct bonding processes. NEO HB combines high precision, flexibility and short cycle time…
NEO HB is a flip-chip bonder designed for ± 1 µm @ 3σ accuracy in stand-alone or full automatic mode (EFEM). It is suitable for Hybrid/Direct bonding processes. NEO HB combines high precision, flexibility and short cycle time. It is dedicated for production.
Applications
- Hybrid / Direct bonding (room temperature)
- Flip-chip bonding, die bonding
- Chip-to-wafer, wafer level applications
- Chip-to-substrate bonding
- Pick & Place
- Memory stacking
- 3D IC