AccuEye™ is a machine vision system designed for through hole component inspection. The design of the system is radically different from the traditional Surface Mount Technology (SMT) inspection machine. AccuEye™ is not data driven but uses images of a known good board to compare with the incoming production boards. The idea is very similar to optical comparator and hence the name Automatic Comparative Inspection machine (ACI). 

The cushions are the main protection placed inside the wafer carriers and absorbing external chocks and internal moves of the wafers stack. They are compatible with 4“, 5“, 6“, 8“ and 12“ wafers, and exist with different thicknesses: 3mm, 5mm and 6mm.

Their multi-layer structure improves their mechanical performances and offers a high purity grade. One thick PE core is covered with PE films on both sides.

ADT dicing blades are high-quality cutting tools designed for precise and clean cutting of hard and brittle materials, such as ceramics, glass, and semiconductors. Since it is made of diamond or cubic boron nitride, these blades offer excellent durability and are available in various shapes and sizes to accommodate different cutting applications. ADT dicing Blades provide efficient and reliable cutting performance which is ideal for use in the semiconductor industry and electronic component production.

Key Features

• Designed for cutting hard and brittle materials
• Minimizes chipping and cracking
• Long-lasting performance

This reliable Diamond Scriber performs fast, easy and precise scribing and cutting of silicon wafers, as well as thin and thick film ceramic and glass substraits. It forms the grooves necessary for effective glass or ceramic cutting: shallow, even and continuous.

This table top soldering system is the ideal tool for R&D applications. With its rapid thermal annealing and brazing capabilities the SRO-700 is equally suited for your basic reflow soldering applications as well as all your R&D assignments. A cold wall chamber principle in combination with the IR lamp heating technology and the vacuum option will reward you with all the required process repeatability and perfect void free solder joints.

The Omega™ 4000 CO2 cleaning module provides powerful dry ice cleaning and surface preparation. The CO2 integrated spray is capable of quickly removing thin film, dust, and other surface contamination without damaging the part.

Uniquely designed, this compact cleaning unit comes in a stainless steel or powdercoated white frame. Test results have proven surfaces are prepared as good or better with the Omega™ 4000 than using etchants and dangerous solvents.

An optional, powerful combination of atmospheric plasma technology and integrated CO2 spray can be used to further break the bonds of tough organics. A final pass with CO2 spray removes the remaining debris, leaving a clean and high energy surface for bonding, coating, encapsulation, or under-fill processes.

OvenSENTINEL™, the latest continuous monitoring solution from ECD, sets the new standard in reflow process monitoring and product traceability. OvenSENTINEL leapfrogs competitor product to deliver unmatched measurement and visibility – down to the board and profile specification level – isolating and analyzing potentially damaging process variations. Completely customizable with user-specified dashboards, expanded sensor inputs, and flexible data extractions. OvenSENTINEL allows detailed and actionable reflow process oversight.

Thermal profiling is the recording of time and temperature throughout a thermal process – most often to measure exposure within an oven. Used in many industries, thermal profiling collects data on a product’s thermal transformation experience, which is then analyzed to optimize complex process settings and conditions to ensure quality results.

A pioneer in the design of the traveling thermal profiler, ECD has developed a suite of thermal data logging products that serve the electronics, baking, industrial and solar industries, among others.