Scia Systems – PEVCD/RIE Systems – scia Batch 350
The scia Batch 350 is designed for homogeneous coating of several 3‑dimensional shaped substrates in one batch. Typical applications are biocompatible films for medical objects.
The scia Batch 350 uses a RF parallel plate arrangement with rotation of each substrate for a homogeneous coating of all sides. The system is also available with an additional DC bias applied to the substrate holder.
Technical Specifications
| Carrier Size | 2 carriers with maximum size of 350 mm x 240 mm |
|---|---|
| Substrate Holder | Water cooled, pulsed DC bias |
| Plasma Source | RF parallel plate arrangement, 13.56 MHz |
| Max. RF Power | 2 x 600 W |
| Electrode Setup | Temperature: Heating up to 400°C |
| Distance: Adjustable between 50 mm and 150 mm | |
| Operation Modes | Independent or coupled electrodes |
| Typical Deposition Rate | SiC: 5 nm/min |
| Base Pressure | < 5 x 10-7 mbar |
| System Dimensions (W x D x H) | 0.90 m x 1.70 m x 2.30 m (without electrical rack and pumps) |
| Tool Configuration | 1 process chamber with manual loading |
| Software Interface | SECS II / GEM |
Key Industries
- Semiconductor, Solar & Electronics
Manufacturer of advanced ion beam and plasma processing systems, scia Systems established itself in a very short time on the…
