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OCTOPUS II – PECVD/PVD system can cover a broad range of deposition job constellations, up to 6 deposition modules
OCTOPUS II – PECVD/PVD system can cover a broad range of deposition job constellations, up to 6 deposition modules
The chuck repair service is dedicated to wafer chucks damaged in device manufacturing processes to a state equivalent to new using our vast knowledge of ceramics.
• for photolithography on ASML, Nikon, Canon, …
The chuck repair service is dedicated to wafer chucks damaged in device manufacturing processes to a state equivalent to new using our vast knowledge of ceramics.
• for photolithography on ASML, Nikon, Canon, …
• for Etching/CVD on Novellus (LAM), SPTS, Anelva, Nissim, …
Please, consult us for machine compatibilities and designs.
Electrostatic chucks and ceramic heaters can be produced by sintering materials with metallic electrodes arranged in the ceramics. We can provide electrostatic chucks and ceramic heaters catering to user needs by utilizing sever…
Electrostatic chucks and ceramic heaters can be produced by sintering materials with metallic electrodes arranged in the ceramics. We can provide electrostatic chucks and ceramic heaters catering to user needs by utilizing several material technologies. We can also provide services for the development and experimental production of electrostatic chucks and ceramic heaters according to region of use such as plasma and electron beam environments:
Electrostatic chuck with heater (ESC/Heater)
Material: AIN (Aluminum nitride)
Electrostatic chucks (ESC)
Material: Al2O3(Alumina) plate
Material: Thermal sprayed Al2O3
Ceramic heater
Material: AIN (Aluminum nitride)
The original manufacturing method enhances adhesiveness between porous sections and base sections to achieve sufficient flatness even at boundary sections.
We can provide highly productive and reliable wafer thinning processing and manufact…
The original manufacturing method enhances adhesiveness between porous sections and base sections to achieve sufficient flatness even at boundary sections.
We can provide highly productive and reliable wafer thinning processing and manufacturing requiring whole surface absorption of large sized substrates.
We offer a wide selection of porous bodies with using different materials and pore sizes to cater to user needs.
We can provide optimal pin chucks tailored to strict requirements through customized design using world-class flattening process technology (flatness of 0.2 μm for 12-inch chucks).
Can flexibly be adjusted planar shapes of pin chucks with …
We can provide optimal pin chucks tailored to strict requirements through customized design using world-class flattening process technology (flatness of 0.2 μm for 12-inch chucks).
Can flexibly be adjusted planar shapes of pin chucks with variable unevenness according to the shapes of wafers and customize absorption zones and pin patterns to enhance absorption responsiveness:
PEER Group® provides the largest portfolio of equipment connectivity and automation software products to equipment makers (OEMs) in the semiconductor and related industries. With over 100,000 licenses shipped, PEER Group is the leading supplier o…
PEER Group® provides the largest portfolio of equipment connectivity and automation software products to equipment makers (OEMs) in the semiconductor and related industries. With over 100,000 licenses shipped, PEER Group is the leading supplier of factory automation software for Smart Manufacturing and Industry 4.0.
PEER Group® provides the largest portfolio of factory automation software products and services to high-volume manufacturers in the semiconductor and related industries. With over 100,000 licenses shipped, PEER Group is the leading supplier of fa…
PEER Group® provides the largest portfolio of factory automation software products and services to high-volume manufacturers in the semiconductor and related industries. With over 100,000 licenses shipped, PEER Group is the leading supplier of factory automation software for Smart Manufacturing and Industry 4.0.
The PIA | nova® is a modular, highly automated coating platform for depositing metallic contact coatings, transparent conductive oxides (TCO) and various absorber coatings such as for CIGS or CdTe technology. The modul…
The PIA | nova® is a modular, highly automated coating platform for depositing metallic contact coatings, transparent conductive oxides (TCO) and various absorber coatings such as for CIGS or CdTe technology. The modular concept allows the combination of high reliability and efficiency with the unique flexibility of configuring the coater according to the requirements of the customer.
VON ARDENNE provides tailored web coating solutions for today’s most ambitious thin-film applications on polymer films, flexible glass and metal strip. These solutions comprise coating equipment, key technology components …
VON ARDENNE provides tailored web coating solutions for today’s most ambitious thin-film applications on polymer films, flexible glass and metal strip. These solutions comprise coating equipment, key technology components and application technology. Our customers benefit from our extensive process know-how and our experience, which we have gained for more than 20 years in roll-to-roll coating, 45 years in magnetron sputtering and 60 years in electron beam technology.
VON ARDENNE is the partner of choice, if you are looking for coating solutions for all current and future technologies for high-efficiency solar cells such as the heterojunction cell technology (HJT).
Considerably improved contact structures compared to today’s standards are an essential feature of these cells.
Another crucial aspect is the right key technology for depositing these structures on silicon wafers: Physical vapor deposition (PVD), a technology VON ARDENNE has perfected for more than 60 years. However, the potential of PVD is far from exhausted.
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