NTK Ceratec – Porous Chuck

The original manufacturing method enhances adhesiveness between porous sections and base sections to achieve sufficient flatness even at boundary sections.

We can provide highly productive and reliable wafer thinning processing and manufacturing requiring whole surface absorption of large sized substrates.

We offer a wide selection of porous bodies with using different materials and pore sizes to cater to user needs.

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Overview

Features

Specifications

We can also provide cooling hollow grooves in ceramic bases.
Fixation tools for :

  • Wafer thinning process (grinder, polisher, CMP)
  • Several measuring and inspection devices
  • Processing film sheets and metal substrates

Technical Specifications

Product numberDensity g/cm3Coefficient of elasticity GPaBending strength MPaCoefficient of thermal expansion ×10-6/KCoefficient of thermal conductivity W/m・KElectrical resistance Ω・cm
AluminaA99513.93904507.33030
Alumina porous2.555507.430
Silicon carbideStandard product3.14105004.6170170
Silicon carbide porous2.155504.726

Key Industries

  • Electronics
  • Semiconductor, Solar & Electronics

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NTK Ceratec

NTK CERATEC’s core business revolves around ceramics and solutions using ceramic materials based on the latest processing and coating technology….

    • FRANCE

      Emmanuel Milan, Product Manager

      DKSH Technology 1475 Quai du Rhone 01702 Miribel France

      +33 4 7855 7860

      Contact Now

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