NTK CERATEC’s core business revolves around ceramics and solutions using ceramic materials based on the latest processing and coating technology. The characteristics of ceramics are developed, such as harmlessness, chemical stability, and heat tolerance and pursue ecology through high energy efficiency and energy saving performance in semiconductor and liquid crystal product manufacturing for various cutting-edge fields like electronics and industrial machines.
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The chuck repair service is dedicated to wafer chucks damaged in device manufacturing processes to a state equivalent to new using our vast knowledge of ceramics.
The chuck repair service is dedicated to wafer chucks damaged in device manufacturing processes to a state equivalent to new using our vast knowledge of ceramics.
Electrostatic chucks and ceramic heaters can be produced by sintering materials with metallic electrodes arranged in the ceramics.
Electrostatic chucks and ceramic heaters can be produced by sintering materials with metallic electrodes arranged in the ceramics.
The original manufacturing method enhances adhesiveness between porous sections and base sections to achieve sufficient flatness even at boundary sections.
We can provide highly productive and reliable wafer thinning processing and manufact…
The original manufacturing method enhances adhesiveness between porous sections and base sections to achieve sufficient flatness even at boundary sections.
We can provide highly productive and reliable wafer thinning processing and manufacturing requiring whole surface absorption of large sized substrates.
We offer a wide selection of porous bodies with using different materials and pore sizes to cater to user needs.
We can provide optimal pin chucks tailored to strict requirements through customized design using world-class flattening process technology (flatness of 0.2 μm for 12-inch chucks).
Can flexibly be adjusted planar shapes of pin chucks with …
We can provide optimal pin chucks tailored to strict requirements through customized design using world-class flattening process technology (flatness of 0.2 μm for 12-inch chucks).
Can flexibly be adjusted planar shapes of pin chucks with variable unevenness according to the shapes of wafers and customize absorption zones and pin patterns to enhance absorption responsiveness:
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