AP series plasma treatment machines are suitable for a wide variety of plasma cleaning, surface activation and adhesion improvement applications. These capabilities are used for semiconductor manufacturing, microelectronic packaging and assembly, and by manufacturers of medical and life science devices.

The chuck repair service is dedicated to wafer chucks damaged in device manufacturing processes to a state equivalent to new using our vast knowledge of ceramics.

We can provide optimal pin chucks tailored to strict requirements through customized design using world-class flattening process technology (flatness of 0.2 μm for 12-inch chucks).

Can flexibly be adjusted planar shapes of pin chucks with variable unevenness according to the shapes of wafers and customize absorption zones and pin patterns to enhance absorption responsiveness:

Designed to accurately mark PCB within a production line or as a stand alone system. The PCB is locked in its marking position while the CO2 laser is moved using servo controlled X-Y axis. The user friendly Windows based software allows easy programmable marking position and number of markings. Double sided marking is achievable with an optional integrated inverting unit.

This unit is used for loading of substrates, leadframes or carriers.

The Multi Function Cage-type Buffer offers multiple functions, making it adaptable to diverse manufacturing environments. It efficiently manages product flow, optimizes space utilization, and minimizes the risk of damage during transit.