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  • Achilles – Multilayer Cushions

    The cushions are the main protection placed inside the wafer carriers and absorbing external chocks and internal moves of the wafers stack. They are compatible with 4“, 5“, 6“, 8“ and 12“ wafers, and exist with different thicknesses: 3mm…

    The cushions are the main protection placed inside the wafer carriers and absorbing external chocks and internal moves of the wafers stack. They are compatible with 4“, 5“, 6“, 8“ and 12“ wafers, and exist with different thicknesses: 3mm, 5mm and 6mm.

    Their multi-layer structure improves their mechanical performances and offers a high purity grade. One thick PE core is covered with PE films on both sides.

  • Achilles – Protos spacers and Ring spacers

    The spacers are the interleaves placed in between the wafers for protecting the sides from scratches and particle contamination. They are made with very high pure materials offering extreme performances against the particle contamination and the o…

    The spacers are the interleaves placed in between the wafers for protecting the sides from scratches and particle contamination. They are made with very high pure materials offering extreme performances against the particle contamination and the outgassing risks. All the models have embossed shape and are compatible with 4“, 5“, 6“, 8“ and 12“ wafers and framed-wafers.

    Anti Statics PE: 350µm thick, Surface resistivity <1*10E+12 Ω Conductive PE: 250µm thick, Surface resistivity <1*10E+9 Ω

  • Achilles – Wafer Carriers

    Achilles offers a full range of wafer carriers models depending on the wafer types, all using antistatic and high-purity material, and compatible with packing machines:

    – Protos Carrier MA series Improve the shipping efficiency…

    Achilles offers a full range of wafer carriers models depending on the wafer types, all using antistatic and high-purity material, and compatible with packing machines:

    – Protos Carrier MA series Improve the shipping efficiency, 25 wafers of capacity. Can be used with spacers or rings. For 4“, 5“, 6“, 8“ and 12“ wafers.

    – Protos Carrier ND series Carrier for diced wafers, can contain between 13 and 25 wafers depending on the model. Compatible with 6“, 8“ and 12“ framed wafers.

  • InnoLas Solutions – Linear Table Machine – LINEXO

    LINEXO is a versatile laser processing workstation designed for high-precision applications in the electronic, precision engineering, and photovoltaic industries. It is often used in R&D environments, as well as production of smaller substrat…

    LINEXO is a versatile laser processing workstation designed for high-precision applications in the electronic, precision engineering, and photovoltaic industries. It is often used in R&D environments, as well as production of smaller substrates as e.g. ceramic PCBs.

  • InnoLas Solutions – Split Axis Machine – EXPEGO

    Versatile Laser System for Micro Material Processing

    EXPEGO is a laser processing workstation designed for high-precision applications in the electronic, precision engineering, and phot…

    Versatile Laser System for Micro Material Processing

    EXPEGO is a laser processing workstation designed for high-precision applications in the electronic, precision engineering, and photovoltaic industries. It is mainly used for microvia drilling, cutting (routing), structuring and cavity formation in PCBs with typical dimensions as 610 x 460 mm and 635 x 540 mm.

  • InnoLas Solutions – Split Axis Machine – ULTAGO

    Powerful Laser System for Micro Material Processing

    ULTAGO is a powerful laser processing workstation designed for high-precision applications in the photovoltaic, precision engineering, and electronic in…

    Powerful Laser System for Micro Material Processing

    ULTAGO is a powerful laser processing workstation designed for high-precision applications in the photovoltaic, precision engineering, and electronic industries. It achieves maximum throughput for solar cells or ceramic substrates and is used in high-volume production environments. Different from linear table machines, in the turntable machine loading, unloading, alignment, as well as laser processing are carried out in parallel in order to reach optimum productivity.

  • KOPEL – Cell setter – KSJ-026

    The KOPEL KSJ-026 cell setter employs a self-alignment mechanism that enables high accuracy of ±0.05 mm to ensure stable probing of PV cells to be measured, thus achieving high repeatability of the measured data.

    It is mounted with two d…

    The KOPEL KSJ-026 cell setter employs a self-alignment mechanism that enables high accuracy of ±0.05 mm to ensure stable probing of PV cells to be measured, thus achieving high repeatability of the measured data.

    It is mounted with two dial gauges to precisely set and control the contact pressure of probe pins. In addition, the KSJ-026 cell setter is provided with a cell vacuum contact function and cell temperature control function to easily reproduce measurement conditions and stabilize the FF values.

  • KOPEL – Measuring Unit – KST Series IV

    The light-weight, compact KOPEL KST Series 15A IV measuring unit is available in two models: the KST-P15Ce standard model, and the KST-P15HC2 which is specially designed for high-efficiency PV cells.

    Both models can be connected to and cont…

    The light-weight, compact KOPEL KST Series 15A IV measuring unit is available in two models: the KST-P15Ce standard model, and the KST-P15HC2 which is specially designed for high-efficiency PV cells.

    Both models can be connected to and controlled by the PC mounted with a high-performance IV measurement program developed by KOPEL.
    Models KST-P15Ce and KST-P15HC2 are incorporated, respectively, into the KOPEL KSX-1000 high-performance solar cell test system and the KSX-3000H high-efficiency solar cell test system.

  • KOPEL – Series Probe Bar

    KOPEL KSM Series probe bars enhance the measurement accuracy and repeatability of PV cell IV measurement by providing much higher precision and durability than competitors’ products.
    The KOPEL KSM Series probe bars are mounted on the KO…

    KOPEL KSM Series probe bars enhance the measurement accuracy and repeatability of PV cell IV measurement by providing much higher precision and durability than competitors’ products.
    The KOPEL KSM Series probe bars are mounted on the KOPEL KSJ-026 high-precision cell setter to ensure stable probing. Since probing performance is the key to IV measurement accuracy, the probing bars are an indispensable component for ensuring high repeatability of the measured data. Also, mass-production lines of PV cells require highly durable probe bars to reduce production cost. The KOPEL KSM Series probe bars are capable of withstanding at least 1million contacts for probing.
    The KOPEL KSM Series probe bars have a very thin but strong structure to minimize the shadow of the bar created by the simulated sunlight. And their high durability ensures accurate IV measurement at lower resistance.
    The KOPEL KSM Series probe bars are incorporated into the KOPEL KSX-1000 high-performance solar cell test system and the KSX-3000H high-efficiency solar cell test system.

  • KOPEL – Solar Module Test System – KSX-2012HM

    A High-precision IV Test System that allows accurate measurement of IV of high-efficiency PV modules including HIT® with a 50-ms pulse light.
    It is generally believed that a stationary light or a very long pulse (several hundreds of ms or l…

    A High-precision IV Test System that allows accurate measurement of IV of high-efficiency PV modules including HIT® with a 50-ms pulse light.
    It is generally believed that a stationary light or a very long pulse (several hundreds of ms or longer) is needed to measure HIT® or similar high-efficiency PV modules. Kyoshin, however, has jointly developed an innovative test method, called the “KOPEL Method,” with Japan’s National Institute of Advanced Industrial Science and Technology (AIST).

    By incorporating this KOPEL Method, the KSX-2012HM System is able to accurately measure IV of high-efficiency PV modules such as HIT® using both dark and illuminated IV data. Our IV data using a 50-ms pulse show very good agreement with the IV data measured for a long sweep time of 1000 ms under a stationary light source: the deviation is just 0.2-0.3%. Moreover, the KSX-2012HM System achieves extremely high throughput with the shortest emission interval of approx. 15 seconds.

  • KOPEL – Solar Module Test System – KSX-2012HM

    Un système de test IV de haute précision permet une mesure précise de l’IV de modules photovoltaïques, y compris HIT® avec une lumière pulsée de 50 ms.

    Un système de test IV de haute précision permet une mesure précise de l’IV de modules photovoltaïques, y compris HIT® avec une lumière pulsée de 50 ms.

  • KOPEL – Solar Test System – KSX – 3000H

    The KSX-3000H Solar Cell Test System is an optimum solution for testing high-efficiency PV Cells including HIT® or PERC® PV cells under R&D and Mass-Production Environments.

    The KSX-3000H Solar Cell Test System is an optimum solution for testing high-efficiency PV Cells including HIT® or PERC® PV cells under R&D and Mass-Production Environments.

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    KOPEL – Système d’inspection de cellules solaires – KSX-3000H

    Le KSX-3000H est un système d’inspection de cellules solaires pour tester des cellules photovoltaïques à haute efficacité, y compris des cellules photovoltaïques HIT® ou PERC® dans des environnements de R&D et de production de mas…

    Le KSX-3000H est un système d’inspection de cellules solaires pour tester des cellules photovoltaïques à haute efficacité, y compris des cellules photovoltaïques HIT® ou PERC® dans des environnements de R&D et de production de masse.

  • Mitsubishi Materials – Low Alpha Tin/Silver (SnAg) bathes – SULA – for wafer plating with high plating rate

    The SULA/UTB SnAg bathes are dedicated to semiconductor applications for wafer plating in order to produce bumps.

    Mitsubishi Materials Corp. Electronics proposes a low-alpha product range particularly adapted to the semiconductor industry…

    The SULA/UTB SnAg bathes are dedicated to semiconductor applications for wafer plating in order to produce bumps.

    Mitsubishi Materials Corp. Electronics proposes a low-alpha product range particularly adapted to the semiconductor industry.

    Mitsubishi Materials Corp. Electronics gets 95% of the global market share thanks to their products quality and their know-how. The flexibility and the reliability of their bathes offer a huge process window with the possibility to use current densities from 8 ASD to 15 ASD (up to 8µm/min).

  • NTK Ceratec – Chuck repair service (6”, 8” and 12”)

    The chuck repair service is dedicated to wafer chucks damaged in device manufacturing processes to a state equivalent to new using our vast knowledge of ceramics.

    • for photolithography on ASML, Nikon, Canon, …

    The chuck repair service is dedicated to wafer chucks damaged in device manufacturing processes to a state equivalent to new using our vast knowledge of ceramics.

    • for photolithography on ASML, Nikon, Canon, …

    • for Etching/CVD on Novellus (LAM), SPTS, Anelva, Nissim, …

    Please, consult us for machine compatibilities and designs.

  • NTK Ceratec – Electrostatic Chuck

    Electrostatic chucks and ceramic heaters can be produced by sintering materials with metallic electrodes arranged in the ceramics. We can provide electrostatic chucks and ceramic heaters catering to user needs by utilizing sever…

    Electrostatic chucks and ceramic heaters can be produced by sintering materials with metallic electrodes arranged in the ceramics. We can provide electrostatic chucks and ceramic heaters catering to user needs by utilizing several material technologies. We can also provide services for the development and experimental production of electrostatic chucks and ceramic heaters according to region of use such as plasma and electron beam environments:

    Electrostatic chuck with heater (ESC/Heater)

    Material: AIN (Aluminum nitride)

    Electrostatic chucks (ESC)

    Material: Al2O3(Alumina) plate

    Material: Thermal sprayed Al2O3

    Ceramic heater

    Material: AIN (Aluminum nitride)

  • NTK Ceratec – Porous Chuck

    The original manufacturing method enhances adhesiveness between porous sections and base sections to achieve sufficient flatness even at boundary sections.

    We can provide highly productive and reliable wafer thinning processing and manufact…

    The original manufacturing method enhances adhesiveness between porous sections and base sections to achieve sufficient flatness even at boundary sections.

    We can provide highly productive and reliable wafer thinning processing and manufacturing requiring whole surface absorption of large sized substrates.

    We offer a wide selection of porous bodies with using different materials and pore sizes to cater to user needs.

  • NTK Ceratec – Vacuum Chuck

    We can provide optimal pin chucks tailored to strict requirements through customized design using world-class flattening process technology (flatness of 0.2 μm for 12-inch chucks).

    Can flexibly be adjusted planar shapes of pin chucks with …

    We can provide optimal pin chucks tailored to strict requirements through customized design using world-class flattening process technology (flatness of 0.2 μm for 12-inch chucks).

    Can flexibly be adjusted planar shapes of pin chucks with variable unevenness according to the shapes of wafers and customize absorption zones and pin patterns to enhance absorption responsiveness:

  • Scia Systems – Ion Beam Deposition Systems – scia Coat 200 & scia Coat 500

    The scia Coat 200 is designed for homogeneous coating of 200 mm substrates, such as wafers. Typical applications of the system are multilayer films for magnetic sensors or optical coatings.

    The scia Coat 500 is designed for…

    The scia Coat 200 is designed for homogeneous coating of 200 mm substrates, such as wafers. Typical applications of the system are multilayer films for magnetic sensors or optical coatings.

    The scia Coat 500 is designed for homogeneous coating of high precision optics. Typical applications of the system are multilayer films for X-ray mirrors and filter coatings.

  • Scia Systems – Ion Beam Etching Systems – scia Mill 150 et 200

    The scia Mill 150 is designed for highly uniform Ion Beam Etching and Milling of single substrates up to 150 mm diameter. Carriers or wafers are loaded via an automatic handling system. The substrate holder has helium backside cooling and …

    The scia Mill 150 is designed for highly uniform Ion Beam Etching and Milling of single substrates up to 150 mm diameter. Carriers or wafers are loaded via an automatic handling system. The substrate holder has helium backside cooling and can be tilted and rotated. Typical applications are the structuring of metal films for MEMS and sensors.

    The scia Mill 200 is designed for highly uniform Ion Beam Etching and Milling of wafers up to 200 mm diameter. Carriers or wafers are loaded via an automatic handling system.

  • Scia Systems – Ion Beam Trimming – scia Trim 200

    The scia Trim 200 is designed for high precision film thickness trimming in wafer processing. Typical applications of the system are frequency and thickness trimming in manufacturing of acousto-electrical devices and filters such as bulk …

    The scia Trim 200 is designed for high precision film thickness trimming in wafer processing. Typical applications of the system are frequency and thickness trimming in manufacturing of acousto-electrical devices and filters such as bulk acoustic wave (BAW) or surface acoustic wave (SAW) devices, localized pole trimming for thin film heads (TFH) and trimming of precision thin film resistors.

    The scia Trim 200 is a high volume production system and accommodates a standard semiconductor cassette handling robot. Cluster tools with two process chambers and two cassette load-locks are available.

  • Scia Systems – Magnetron Sputtering Systems – scia Magna 200 and scia Multi 680

    The scia Magna 200 uses a unique Double Ring Magnetron architecture to achieve very high homogeneity of coatings at impressively high deposition rates. Typical applications include piezoelectric layers, optical coatings and passivation la…

    The scia Magna 200 uses a unique Double Ring Magnetron architecture to achieve very high homogeneity of coatings at impressively high deposition rates. Typical applications include piezoelectric layers, optical coatings and passivation layers.  

    The scia Multi 680 is designed for periodic multilayer coatings for substrates up to 650 mm dia. and 50 kg. Typical applications are gradient multilayer coatings of mirrors for soft X‑ray and anti-reflective coatings in UV and X‑ray applications.

  • Scia Systems – PEVCD/RIE Systems – scia Batch 350

    The scia Batch 350 is designed for homogeneous coating of several 3‑dimensional shaped substrates in one batch. Typical applications are biocompatible films for medical objects.  

    The scia Batch 350 uses a RF parallel p…

    The scia Batch 350 is designed for homogeneous coating of several 3‑dimensional shaped substrates in one batch. Typical applications are biocompatible films for medical objects.  

    The scia Batch 350 uses a RF parallel plate arrangement with rotation of each substrate for a homogeneous coating of all sides. The system is also available with an additional DC bias applied to the substrate holder.

  • Scia Systems – PEVCD/RIE Systems – scia Cube 300/750

    The scia Cube 300/750 are designed for large area high density plasma processes of substrates up to 300 mm x 200 mm (scia Coat 300) and up to 750 mm x 750 mm (scia Coat 750). Typical applications are deposition of Diamond Like Carbon (DLC…

    The scia Cube 300/750 are designed for large area high density plasma processes of substrates up to 300 mm x 200 mm (scia Coat 300) and up to 750 mm x 750 mm (scia Coat 750). Typical applications are deposition of Diamond Like Carbon (DLC) for optical filters and dielectric films for anti-reflective coatings as well as etching processes with oxygen or halogen chemistry for the structuring of Semiconductors and metals.

     

    The scia Cube 300/750 combine plasma excitation by an array of microwave sources. The substrate stage is equipped with an independent a RF bias. Various substrate sizes can be transferred with an automatic vacuum load-lock system.

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