InnoLas Solutions – Split Axis Machine – ULTAGO
Powerful Laser System for Micro Material Processing
ULTAGO is a powerful laser processing workstation designed for high-precision applications in the photovoltaic, precision engineering, and electronic industries. It achieves maximum throughput for solar cells or ceramic substrates and is used in high-volume production environments. Different from linear table machines, in the turntable machine loading, unloading, alignment, as well as laser processing are carried out in parallel in order to reach optimum productivity.
Technical Specifications
| Applications | Laser Contact Opening for PERC, Laser Doped Selective Emitter, Front side LCO, Laser Direct Cleaving, various applications in electronics processing |
| Accuracy | < +/-35 μm (1 sigma) < +/-10 μm optionally < +/-2 μm repeatability |
|---|---|
| Substrate | Dimension up to 161 x 161 mm Thickness > 100 μm mono or poly crystalline silicon square/ pseudo square, ceramic, PCB |
| Available laser sources | Wavelength: 1064, 1030, 532, 515, 355 nm Pulse: μs, ns, ps, fs |
| Throughput | 4000 wafer per hour |
Key Features
ILS-TT
- Single or dual scanner setup
- Automatic camera calibration
- Automated routines for reference runs
- Automated process control
- Stand alone and production line integrated systems
- 3-, 5- or even 8-Point alignment methods available (wafer edges or fiducials)
InnoLas Solutions ILS TT for PERC
Key Industries
- Semiconductor, Solar & Electronics
InnoLas Solutions was founded in October 2013 as a demerger of InnoLas PV and electronic business and looks back on…
