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This unit is used to redirect flow of PCBs into different channels in a production line.
This unit is used to redirect flow of PCBs into different channels in a production line.
The Multi Function Cage-type Buffer offers multiple functions, making it adaptable to diverse manufacturing environments. It efficiently manages product flow, optimizes space utilization, and minimizes the risk of damage during …
The Multi Function Cage-type Buffer offers multiple functions, making it adaptable to diverse manufacturing environments. It efficiently manages product flow, optimizes space utilization, and minimizes the risk of damage during transit. The buffer system’s intelligent control system ensures smooth and synchronized operations, reducing bottlenecks and enhancing overall productivity.
The NTA In-line Workstation is used to link between SMD machines or board handling units. It also allows manual assembly work to be carried out.
The NTA In-line Workstation is used to link between SMD machines or board handling units. It also allows manual assembly work to be carried out.
For customers with preference of traditional dishwasher style machine, CompaCLEAN provides the type of cleaning many are accustomed to while minimising the shadow effect thanks to unique linear tangent spray technology. PCBs are…
For customers with preference of traditional dishwasher style machine, CompaCLEAN provides the type of cleaning many are accustomed to while minimising the shadow effect thanks to unique linear tangent spray technology. PCBs are loaded just like plates into a typical kitchen dishwasher.
Top-end solution for customers looking for both high quality cleaning result and high throughput with focus on data management and automation. This machine can provide maximum data output with minimum human interaction.
Top-end solution for customers looking for both high quality cleaning result and high throughput with focus on data management and automation. This machine can provide maximum data output with minimum human interaction.
This machine is a budget solution for anyone who does not expect to clean PCBAs on daily basis. Typically Research and Development centres, prototyping, start-ups and very low volume producers would find this machine sufficient …
This machine is a budget solution for anyone who does not expect to clean PCBAs on daily basis. Typically Research and Development centres, prototyping, start-ups and very low volume producers would find this machine sufficient to achieve great results.
Application: Standard SMD Assemblies. Capacity: Small Volume Contamination Solubility: Easy to Moderate
Ideal machine for customers looking for the best cleaning results without the need for automation or very high throughput. Best solution for medium to low quantity of complex products that need to be cleaned perfectly. Application: High Density SM…
Ideal machine for customers looking for the best cleaning results without the need for automation or very high throughput. Best solution for medium to low quantity of complex products that need to be cleaned perfectly. Application: High Density SMD Assemblies Capacity: Low to Medium Volume Contamination Solubility: Easy to Hard Handling Handling with the parts to clean is simple and safe. SuperSWASH III Reloading Stand
PCBAs are reloaded on the dedicated reloading stand. Operators reloads frames directly into machine chamber. This minimizes downtime to zero and provides comfortable time for reload.
PEER Group® provides the largest portfolio of equipment connectivity and automation software products to equipment makers (OEMs) in the semiconductor and related industries. With over 100,000 licenses shipped, PEER Group is the leading supplier o…
PEER Group® provides the largest portfolio of equipment connectivity and automation software products to equipment makers (OEMs) in the semiconductor and related industries. With over 100,000 licenses shipped, PEER Group is the leading supplier of factory automation software for Smart Manufacturing and Industry 4.0.
PEER Group® provides the largest portfolio of factory automation software products and services to high-volume manufacturers in the semiconductor and related industries. With over 100,000 licenses shipped, PEER Group is the leading supplier of fa…
PEER Group® provides the largest portfolio of factory automation software products and services to high-volume manufacturers in the semiconductor and related industries. With over 100,000 licenses shipped, PEER Group is the leading supplier of factory automation software for Smart Manufacturing and Industry 4.0.
Sakaguchi has engaged in a broad spectrum of activities encompassing heating energy created in all kinds of industries such as, electric power, petrochemical plants, electronics and environmental protection. We offer a wide range of heaters, incl…
Sakaguchi has engaged in a broad spectrum of activities encompassing heating energy created in all kinds of industries such as, electric power, petrochemical plants, electronics and environmental protection. We offer a wide range of heaters, including heaters for flat and tubular form, liquid and gas, gas and infrared, mold heating and injection molding, compact high-output ceramic heaters and as well as other custom products.
The scia Coat 200 is designed for homogeneous coating of 200 mm substrates, such as wafers. Typical applications of the system are multilayer films for magnetic sensors or optical coatings.
The scia Coat 500 is designed for…
The scia Coat 200 is designed for homogeneous coating of 200 mm substrates, such as wafers. Typical applications of the system are multilayer films for magnetic sensors or optical coatings.
The scia Coat 500 is designed for homogeneous coating of high precision optics. Typical applications of the system are multilayer films for X-ray mirrors and filter coatings.
The scia Mill 150 is designed for highly uniform Ion Beam Etching and Milling of single substrates up to 150 mm diameter. Carriers or wafers are loaded via an automatic handling system. The substrate holder has helium backside cooling and …
The scia Mill 150 is designed for highly uniform Ion Beam Etching and Milling of single substrates up to 150 mm diameter. Carriers or wafers are loaded via an automatic handling system. The substrate holder has helium backside cooling and can be tilted and rotated. Typical applications are the structuring of metal films for MEMS and sensors.
The scia Mill 200 is designed for highly uniform Ion Beam Etching and Milling of wafers up to 200 mm diameter. Carriers or wafers are loaded via an automatic handling system.
The scia Trim 200 is designed for high precision film thickness trimming in wafer processing. Typical applications of the system are frequency and thickness trimming in manufacturing of acousto-electrical devices and filters such as bulk …
The scia Trim 200 is designed for high precision film thickness trimming in wafer processing. Typical applications of the system are frequency and thickness trimming in manufacturing of acousto-electrical devices and filters such as bulk acoustic wave (BAW) or surface acoustic wave (SAW) devices, localized pole trimming for thin film heads (TFH) and trimming of precision thin film resistors.
The scia Trim 200 is a high volume production system and accommodates a standard semiconductor cassette handling robot. Cluster tools with two process chambers and two cassette load-locks are available.
The scia Magna 200 uses a unique Double Ring Magnetron architecture to achieve very high homogeneity of coatings at impressively high deposition rates. Typical applications include piezoelectric layers, optical coatings and passivation la…
The scia Magna 200 uses a unique Double Ring Magnetron architecture to achieve very high homogeneity of coatings at impressively high deposition rates. Typical applications include piezoelectric layers, optical coatings and passivation layers.
The scia Multi 680 is designed for periodic multilayer coatings for substrates up to 650 mm dia. and 50 kg. Typical applications are gradient multilayer coatings of mirrors for soft X‑ray and anti-reflective coatings in UV and X‑ray applications.
The scia Batch 350 is designed for homogeneous coating of several 3‑dimensional shaped substrates in one batch. Typical applications are biocompatible films for medical objects.
The scia Batch 350 uses a RF parallel p…
The scia Batch 350 is designed for homogeneous coating of several 3‑dimensional shaped substrates in one batch. Typical applications are biocompatible films for medical objects.
The scia Batch 350 uses a RF parallel plate arrangement with rotation of each substrate for a homogeneous coating of all sides. The system is also available with an additional DC bias applied to the substrate holder.
The scia Cube 300/750 are designed for large area high density plasma processes of substrates up to 300 mm x 200 mm (scia Coat 300) and up to 750 mm x 750 mm (scia Coat 750). Typical applications are deposition of Diamond Like Carbon (DLC…
The scia Cube 300/750 are designed for large area high density plasma processes of substrates up to 300 mm x 200 mm (scia Coat 300) and up to 750 mm x 750 mm (scia Coat 750). Typical applications are deposition of Diamond Like Carbon (DLC) for optical filters and dielectric films for anti-reflective coatings as well as etching processes with oxygen or halogen chemistry for the structuring of Semiconductors and metals.
The scia Cube 300/750 combine plasma excitation by an array of microwave sources. The substrate stage is equipped with an independent a RF bias. Various substrate sizes can be transferred with an automatic vacuum load-lock system.
The Phoenix series is designed to offer the flexibility required for QA. R&D and engineering process development. The Phoenix is a quite simple and virtually any measure size without sample cutting sample cutting preparatio…
The Phoenix series is designed to offer the flexibility required for QA. R&D and engineering process development. The Phoenix is a quite simple and virtually any measure size without sample cutting sample cutting preparation. Light-weight means simple control device and simple handling. Phoenix adopted USB type camera. Easily connect to laptop and desktop computer with Surfaceware software.
Phoenix MT is the world’s first model that can be used by turning the equipment, the individual modules can be separated, and the length of each main frame can be selected to change the model to suit almost all samples.
Phoenix MT is the world’s first model that can be used by turning the equipment, the individual modules can be separated, and the length of each main frame can be selected to change the model to suit almost all samples.
The ACCµRA M is a manual flip-chip bonder that allows ± 3 µm accuracy. This equipment permits to align manually the components with a high level of precision. The motorized arm controls precisely the bonding force. Combining and synchronizing the arm with the temperature controller, it guarantees a perfect quality and high repeatability of your process. The ACCµRA M, more than a pick-and-place system, offers thermocompression and reflow capabilities. It is the perfect equipment for universities and R&D institutes.
The ACCµRA OPTO is a flip-chip bonder that allows ± 0.5 µm accuracy. It is dedicated to low force and reflow processes. The ACCµRA OPTO combines high precision, flexibility and accessibility. It is the perfect equipment for optoelectronics an…
The ACCµRA OPTO is a flip-chip bonder that allows ± 0.5 µm accuracy. It is dedicated to low force and reflow processes. The ACCµRA OPTO combines high precision, flexibility and accessibility. It is the perfect equipment for optoelectronics and silicon photonics applications.
ACCµRA Plus is a flip-chip bonder designed for ± 0.5 µm accuracy in full automatic mode. It is suitable for reflow and thermocompression processes.
ACCµRA Plus combines high pr…
ACCµRA Plus is a flip-chip bonder designed for ± 0.5 µm accuracy in full automatic mode. It is suitable for reflow and thermocompression processes.
ACCµRA Plus combines high precision, flexibility and short cycle time. It is dedicated to production for Optoelectronic and Silicon photonics applications.
Applications
Industries
The ACCµRA100 is a flip-chip bonder that allows ± 0.5 µm accuracy. Motorized axes guarantee a high repeatability of your process. Its flexibility makes it ideal for developing a wide range of applications. ACCµRA100 combines…
The ACCµRA100 is a flip-chip bonder that allows ± 0.5 µm accuracy. Motorized axes guarantee a high repeatability of your process. Its flexibility makes it ideal for developing a wide range of applications. ACCµRA100 combines high precision, accessibility and cost-effectiveness. It is the perfect equipment for universities and R&D institutes.
Applications
Industries
The FC150 is an accurate and very flexible flip-chip bonder for Chip-to-Chip (up to 100 mm) and Chip-to-Wafer (up to 200 mm) applications on the same open platform.
The versatile design and the possibility to combine different processes make the FC150 ideal for developing a wide range of assembly applications including focal plane arrays and optoelectronic devices.
Perfect for advanced R&D, the FC150 is also appreciated for pilot production thanks to its full automatization.
The FC300 is a high accuracy and high force flip-chip bonder for Chip-to-Chip (up to 100 mm) and Chip-to-Wafer (up to 300 mm) applications. FC300 covers a large range of bonding forces, from 1 to 4000N. That makes it perfectly suitable for reflow and thermocompression processes.
The leveling between both components is adjusted before each bonding within 1 µradian. The parallelism adjustment, the high resolution alignment and the perfect control of all bonding parameters allow to achieve submicronic post-bond accuracy.
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