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Showing 1297–1320 of 1547 results

  • Scia Systems - Ion Beam Deposition Systems - scia Coat 200 & scia Coat 500

    Scia Systems – Ion Beam Deposition Systems – scia Coat 200 & scia Coat 500

    The scia Coat 200 is designed for homogeneous coating of 200 mm substrates, such as wafers. Typical applications of the system are multilayer films for magnetic sensors or optical coatings.

    The scia Coat 500 is designed for homogeneous c…

    The scia Coat 200 is designed for homogeneous coating of 200 mm substrates, such as wafers. Typical applications of the system are multilayer films for magnetic sensors or optical coatings.

    The scia Coat 500 is designed for homogeneous coating of high precision optics. Typical applications of the system are multilayer films for X-ray mirrors and filter coatings.

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  • Scia Systems - Ion Beam Etching Systems - scia Mill 150 et 200

    Scia Systems – Ion Beam Etching Systems – scia Mill 150 et 200

    The scia Mill 150 is designed for highly uniform Ion Beam Etching and Milling of single substrates up to 150 mm diameter. Carriers or wafers are loaded via an automatic handling system. The substrate holder has helium backside cooling and can be t…

    The scia Mill 150 is designed for highly uniform Ion Beam Etching and Milling of single substrates up to 150 mm diameter. Carriers or wafers are loaded via an automatic handling system. The substrate holder has helium backside cooling and can be tilted and rotated. Typical applications are the structuring of metal films for MEMS and sensors.

    The scia Mill 200 is designed for highly uniform Ion Beam Etching and Milling of wafers up to 200 mm diameter. Carriers or wafers are loaded via an automatic handling system.

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  • Scia Systems - Ion Beam Trimming - scia Trim 200

    Scia Systems – Ion Beam Trimming – scia Trim 200

    The scia Trim 200 is designed for high precision film thickness trimming in wafer processing. Typical applications of the system are frequency and thickness trimming in manufacturing of acousto-electrical devices and filters such as bulk acousti…

    The scia Trim 200 is designed for high precision film thickness trimming in wafer processing. Typical applications of the system are frequency and thickness trimming in manufacturing of acousto-electrical devices and filters such as bulk acoustic wave (BAW) or surface acoustic wave (SAW) devices, localized pole trimming for thin film heads (TFH) and trimming of precision thin film resistors.

    The scia Trim 200 is a high volume production system and accommodates a standard semiconductor cassette handling robot. Cluster tools with two process chambers and two cassette load-locks are available.

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  • Scia Systems - Magnetron Sputtering Systems - scia Magna 200 and scia Multi 680

    Scia Systems – Magnetron Sputtering Systems – scia Magna 200 and scia Multi 680

    The scia Magna 200 uses a unique Double Ring Magnetron architecture to achieve very high homogeneity of coatings at impressively high deposition rates. Typical applications include piezoelectric layers, optical coatings and passivation layers.

    …

    The scia Magna 200 uses a unique Double Ring Magnetron architecture to achieve very high homogeneity of coatings at impressively high deposition rates. Typical applications include piezoelectric layers, optical coatings and passivation layers.

    The scia Multi 680 is designed for periodic multilayer coatings for substrates up to 650 mm dia. and 50 kg. Typical applications are gradient multilayer coatings of mirrors for soft X‑ray and anti-reflective coatings in UV and X‑ray applications.

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  • Scia Systems - PEVCD/RIE Systems - scia Batch 350

    Scia Systems – PEVCD/RIE Systems – scia Batch 350

    The scia Batch 350 is designed for homogeneous coating of several 3‑dimensional shaped substrates in one batch. Typical applications are biocompatible films for medical objects.

    The scia Batch 350 is designed for homogeneous coating of several 3‑dimensional shaped substrates in one batch. Typical applications are biocompatible films for medical objects.

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  • Scia Systems - PEVCD/RIE Systems - scia Cube 300/750

    Scia Systems – PEVCD/RIE Systems – scia Cube 300/750

    The scia Cube 300/750 are designed for large area high density plasma processes of substrates up to 300 mm x 200 mm (scia Coat 300) and up to 750 mm x 750 mm (scia Coat 750). Typical applications are deposition of Diamond Like Carbon (DLC) for o…

    The scia Cube 300/750 are designed for large area high density plasma processes of substrates up to 300 mm x 200 mm (scia Coat 300) and up to 750 mm x 750 mm (scia Coat 750). Typical applications are deposition of Diamond Like Carbon (DLC) for optical filters and dielectric films for anti-reflective coatings as well as etching processes with oxygen or halogen chemistry for the structuring of Semiconductors and metals.

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  • SEDFLOC - Physico-chemical Technology

    SEDFLOC – Physico-chemical Technology

    Designed to treat wastewater containing pollutants such as:
    – Inert mineral substances
    – Organic substances
    – Mineral oils
    – Detergents
    – Solvents
    – Paints

    Designed to treat wastewater containing pollutants such as:
    – Inert mineral substances
    – Organic substances
    – Mineral oils
    – Detergents
    – Solvents
    – Paints

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  • Semi-Automatic Fillers

    Semi-Automatic Fillers

    Semi-automatic fillers (volumetric or gravimetric) consist of a filling station, with the option to add a semi-automatic capping station for press-on lids, screw caps, or push-on caps (other options available

    Semi-automatic fillers (volumetric or gravimetric) consist of a filling station, with the option to add a semi-automatic capping station for press-on lids, screw caps, or push-on caps (other options available

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  • SEO - Phoenix (Portable)

    SEO – Phoenix (Portable)

    The Phoenix series is designed to offer the flexibility required for QA. R&D and engineering process development. The Phoenix is a quite simple and virtually any measure size without sample cutting sample cutting preparation…

    The Phoenix series is designed to offer the flexibility required for QA. R&D and engineering process development. The Phoenix is a quite simple and virtually any measure size without sample cutting sample cutting preparation. Light-weight means simple control device and simple handling. Phoenix adopted USB type camera. Easily connect to laptop and desktop computer with Surfaceware software.

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  • SEO - Phoenix MT

    SEO – Phoenix MT

    Phoenix MT is the world’s first model that can be used by turning the equipment, the individual modules can be separated, and the length of each main frame can be selected to change the model to suit almost all samples.

    Phoenix MT is the world’s first model that can be used by turning the equipment, the individual modules can be separated, and the length of each main frame can be selected to change the model to suit almost all samples.

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  • Sercon – Isotope Ratio Mass Spectrometer (IRMS)

    Sercon – Isotope Ratio Mass Spectrometer (IRMS)

    Sercon Isotope Ratio Mass Spectrometer (IRMS)

    Sercon Isotope Ratio Mass Spectrometer (IRMS)

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  • SET - ACCµRA M

    SET – ACCµRA M

    The ACCµRA M is a manual flip-chip bonder that allows ± 3 µm accuracy. This equipment permits to align manually the components with a high level of precision. The motorized arm controls precisely the bonding force. Combining and synchronizing t…

    The ACCµRA M is a manual flip-chip bonder that allows ± 3 µm accuracy. This equipment permits to align manually the components with a high level of precision. The motorized arm controls precisely the bonding force. Combining and synchronizing the arm with the temperature controller, it guarantees a perfect quality and high repeatability of your process.

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  • SET - ACCµRA OPTO

    SET – ACCµRA OPTO

    The ACCµRA OPTO is a flip-chip bonder that allows ± 0.5 µm accuracy. It is dedicated to low force and reflow processes.

    The ACCµRA OPTO is a flip-chip bonder that allows ± 0.5 µm accuracy. It is dedicated to low force and reflow processes.

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  • SET - ACCµRA Plus

    SET – ACCµRA Plus

    ACCµRA Plus is a flip-chip bonder designed for ± 0.5 µm accuracy in full automatic mode. It is suitable for reflow and thermocompression processes.

    ACCµRA Plus is a flip-chip bonder designed for ± 0.5 µm accuracy in full automatic mode. It is suitable for reflow and thermocompression processes.

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  • SET - ACCµRA100

    SET – ACCµRA100

    The ACCµRA100 is a flip-chip bonder that allows ± 0.5 µm accuracy. Motorized axes guarantee a high repeatability of your process. Its flexibility makes it ideal for developing a wide range of applications. ACCµRA100 combines…

    The ACCµRA100 is a flip-chip bonder that allows ± 0.5 µm accuracy. Motorized axes guarantee a high repeatability of your process. Its flexibility makes it ideal for developing a wide range of applications. ACCµRA100 combines high precision, accessibility and cost-effectiveness.

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  • SET - FC150

    SET – FC150

    The FC150 is an accurate and very flexible flip-chip bonder for Chip-to-Chip (up to 100 mm) and Chip-to-Wafer (up to 200 mm) applications on the same open platform.

    The FC150 is an accurate and very flexible flip-chip bonder for Chip-to-Chip (up to 100 mm) and Chip-to-Wafer (up to 200 mm) applications on the same open platform.

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  • SET - FC300

    SET – FC300

    The FC300 is a high accuracy and high force flip-chip bonder for Chip-to-Chip (up to 100 mm) and Chip-to-Wafer (up to 300 mm) applications. FC300 covers a large range of bonding forces, from 1 to 4000N. That makes it perfectly suitable for reflow …

    The FC300 is a high accuracy and high force flip-chip bonder for Chip-to-Chip (up to 100 mm) and Chip-to-Wafer (up to 300 mm) applications. FC300 covers a large range of bonding forces, from 1 to 4000N. That makes it perfectly suitable for reflow and thermocompression processes.

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  • SET - LDP150

    SET – LDP150

    The LDP150 is an electrical Press especially designed for bonding large light or radiation detectors (50 ~ 150mm). It uses compression process at room temperature (thermo-compression option available).

    The LDP150 is an electrical Press especially designed for bonding large light or radiation detectors (50 ~ 150mm). It uses compression process at room temperature (thermo-compression option available).

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  • SET - NEO HB

    SET – NEO HB

    NEO HB is a flip-chip bonder designed for ± 1 µm @ 3σ accuracy in stand-alone or full automatic mode (EFEM). It is suitable for Hybrid/Direct bonding processes. NEO HB combines high precision, flexibility and short cycle time.

    NEO HB is a flip-chip bonder designed for ± 1 µm @ 3σ accuracy in stand-alone or full automatic mode (EFEM). It is suitable for Hybrid/Direct bonding processes. NEO HB combines high precision, flexibility and short cycle time.

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  • SET - NPS300

    SET – NPS300

    Optimized for the production of nanostructures, the Nano imPrinting stepper Stepper NPS300 is the first ever tool able to combine Hot Embossing and UV-NIL on a same platform. The NPS300 is able to print sub-20 nm geometries with …

    Optimized for the production of nanostructures, the Nano imPrinting stepper Stepper NPS300 is the first ever tool able to combine Hot Embossing and UV-NIL on a same platform. The NPS300 is able to print sub-20 nm geometries with an overlay accuracy of 250 nm, when in-situ alignment is performed.

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  • Sherwood - Flame Photometer Range

    Sherwood – Flame Photometer Range

    The estimation of the Alkali metals by Flame Photometry (e.g. Sodium determination in Foods, Sodium and Potassium determination in Cement), is by far the most important application of Flame Photometers in routine chemical analysis. For this widesp…

    The estimation of the Alkali metals by Flame Photometry (e.g. Sodium determination in Foods, Sodium and Potassium determination in Cement), is by far the most important application of Flame Photometers in routine chemical analysis. For this widespread requirement, low temperature Flame Photometers still provide the most reliable and convenient procedure available.

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  • Sherwood – Model 501 Fluid Bed Dryer

    Sherwood – Model 501 Fluid Bed Dryer

    By forcing enough air through a bed of particles, the particle bed may assume a fluid-like state (resembling a boiling liquid).  

    By forcing enough air through a bed of particles, the particle bed may assume a fluid-like state (resembling a boiling liquid).  

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  • Shine - Atmosphere On-line IC

    Shine – Atmosphere On-line IC

    SH-GIC7000 is a full-automatic and intelligent on-line IC for atmosphere, which can detect anions and cations in TSP, PM2.5, PM10 and dustfall to meet the testing requirements of HJ799-2016 and HJ800-2016. The instrument runs c…

    SH-GIC7000 is a full-automatic and intelligent on-line IC for atmosphere, which can detect anions and cations in TSP, PM2.5, PM10 and dustfall to meet the testing requirements of HJ799-2016 and HJ800-2016. The instrument runs continuously for 24 hours and can work continuously for 20 days after one maintenance.

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  • Shine - Ion Chromatograph - CIC-D100

    Shine – Ion Chromatograph – CIC-D100

    CIC-D100 ion chromatograph is a classic product of SHINE, which has been accepted by many customers.Based on the latest requirements of users, a newly upgraded CIC-D100 for conventional detection came into being.The new IC not only can detect anio…

    CIC-D100 ion chromatograph is a classic product of SHINE, which has been accepted by many customers.Based on the latest requirements of users, a newly upgraded CIC-D100 for conventional detection came into being.The new IC not only can detect anions, cations and other polar substances in different matrix samples, but also separate ions with 4 orders of magnitude difference.

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