Next-generation and time-tested capabilities are combined in this upgraded system to increase productivity by up to 50% over the top-selling Spectrum^® ll, all in a space-saving footprint.

SPHERE series systems support automated handling and processing of round or square wafer/substrate sizes ranging from 75mm to 300mm. In addition, thin wafer processing with or without carriers is possible, depending upon wafer thickness.

The patented plasma chamber design provides exceptional etch uniformity and process repeatability. Primary plasma applications include a variety of etching, ashing, and descum steps. Other plasma processes include contamination removal, surface roughening, increasing wettability, and enhancing bonding and adhesion strength, photoresist/polymer stripping, dielectric etch, wafer bumping, organic contamination removal, and wafer destress.

• Wafer Cleaning – The SPHERE series plasma systems remove contamination prior to wafer bumping, remove organic contamination, remove fluorine and other halogen contamination, and remove metal and metal oxides. Plasma also improves spun-on film adhesion and cleans metallic bond pads.
• Wafer Etching – Plasma systems descum wafer of residual photoresist and BCB, pattern dielectric layers for redistribution, strip/etch photoresist, enhance adhesion of wafer applied materials, remove excess wafer applied mold /epoxy, enhance adhesion of gold solder bumps, destress wafer to reduce breakage, improve spun-on film adhesion, and clean aluminum bond pads.

The chuck repair service is dedicated to wafer chucks damaged in device manufacturing processes to a state equivalent to new using our vast knowledge of ceramics.

We can provide optimal pin chucks tailored to strict requirements through customized design using world-class flattening process technology (flatness of 0.2 μm for 12-inch chucks).

Can flexibly be adjusted planar shapes of pin chucks with variable unevenness according to the shapes of wafers and customize absorption zones and pin patterns to enhance absorption responsiveness:

Designed to accurately mark PCB within a production line or as a stand alone system. The PCB is locked in its marking position while the CO2 laser is moved using servo controlled X-Y axis. The user friendly Windows based software allows easy programmable marking position and number of markings. Double sided marking is achievable with an optional integrated inverting unit.

This unit is used for loading of substrates, leadframes or carriers.

The Multi Function Cage-type Buffer offers multiple functions, making it adaptable to diverse manufacturing environments. It efficiently manages product flow, optimizes space utilization, and minimizes the risk of damage during transit. 

For customers with preference of traditional dishwasher style machine, CompaCLEAN provides the type of cleaning many are accustomed to while minimising the shadow effect thanks to unique linear tangent spray technology. PCBs are loaded just like plates into a typical kitchen dishwasher.

Key Features

• Small Footprint
• Single Basket or Double Basket
• Easy Loading
• Basket Oscillation
• Uniform Tangent Spray
• Shadow Mitigating System
• Adaptive Rinse
• Closed or Open Loop
• Low Running Cost