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LINEXO is a versatile laser processing workstation designed for high-precision applications in the electronic, precision engineering, and photovoltaic industries.
LINEXO is a versatile laser processing workstation designed for high-precision applications in the electronic, precision engineering, and photovoltaic industries.
EXPEGO is a laser processing workstation designed for high-precision applications in the electronic, precision engineering, and photovoltaic industries. It is mainly used for microvia drilling, cutting (routing), structuring and…
EXPEGO is a laser processing workstation designed for high-precision applications in the electronic, precision engineering, and photovoltaic industries. It is mainly used for microvia drilling, cutting (routing), structuring and cavity formation in PCBs with typical dimensions as 610 x 460 mm and 635 x 540 mm.
ULTAGO is a powerful laser processing workstation designed for high-precision applications in the photovoltaic, precision engineering, and electronic industries. It achieves maximum throughput for solar cells or ceramic substrat…
ULTAGO is a powerful laser processing workstation designed for high-precision applications in the photovoltaic, precision engineering, and electronic industries. It achieves maximum throughput for solar cells or ceramic substrates and is used in high-volume production environments. Different from linear table machines, in the turntable machine loading, unloading, alignment, as well as laser processing are carried out in parallel in order to reach optimum productivity.
The scia Mill 150 is designed for highly uniform Ion Beam Etching and Milling of single substrates up to 150 mm diameter. Carriers or wafers are loaded via an automatic handling system. The substrate holder has helium backside cooling and can be t…
The scia Mill 150 is designed for highly uniform Ion Beam Etching and Milling of single substrates up to 150 mm diameter. Carriers or wafers are loaded via an automatic handling system. The substrate holder has helium backside cooling and can be tilted and rotated. Typical applications are the structuring of metal films for MEMS and sensors.
The scia Mill 200 is designed for highly uniform Ion Beam Etching and Milling of wafers up to 200 mm diameter. Carriers or wafers are loaded via an automatic handling system.
The scia Trim 200 is designed for high precision film thickness trimming in wafer processing. Typical applications of the system are frequency and thickness trimming in manufacturing of acousto-electrical devices and filters such as bulk acousti…
The scia Trim 200 is designed for high precision film thickness trimming in wafer processing. Typical applications of the system are frequency and thickness trimming in manufacturing of acousto-electrical devices and filters such as bulk acoustic wave (BAW) or surface acoustic wave (SAW) devices, localized pole trimming for thin film heads (TFH) and trimming of precision thin film resistors.
The scia Trim 200 is a high volume production system and accommodates a standard semiconductor cassette handling robot. Cluster tools with two process chambers and two cassette load-locks are available.
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