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Scia Systems – Ion Beam Deposition Systems – scia Coat 200 & scia Coat 500
The scia Coat 200 is designed for homogeneous coating of 200 mm substrates, such as wafers. Typical applications of the system are multilayer films for magnetic sensors or optical coatings.

The scia Coat 500 is designed for…

The scia Coat 200 is designed for homogeneous coating of 200 mm substrates, such as wafers. Typical applications of the system are multilayer films for magnetic sensors or optical coatings.

The scia Coat 500 is designed for homogeneous coating of high precision optics. Typical applications of the system are multilayer films for X-ray mirrors and filter coatings.

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Scia Systems – Ion Beam Etching Systems – scia Mill 150 et 200
The scia Mill 150 is designed for highly uniform Ion Beam Etching and Milling of single substrates up to 150 mm diameter. Carriers or wafers are loaded via an automatic handling system. The substrate holder has helium backside cooling and …

The scia Mill 150 is designed for highly uniform Ion Beam Etching and Milling of single substrates up to 150 mm diameter. Carriers or wafers are loaded via an automatic handling system. The substrate holder has helium backside cooling and can be tilted and rotated. Typical applications are the structuring of metal films for MEMS and sensors.

The scia Mill 200 is designed for highly uniform Ion Beam Etching and Milling of wafers up to 200 mm diameter. Carriers or wafers are loaded via an automatic handling system.

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Scia Systems – Ion Beam Trimming – scia Trim 200
The scia Trim 200 is designed for high precision film thickness trimming in wafer processing. Typical applications of the system are frequency and thickness trimming in manufacturing of acousto-electrical devices and filters such as bulk …

The scia Trim 200 is designed for high precision film thickness trimming in wafer processing. Typical applications of the system are frequency and thickness trimming in manufacturing of acousto-electrical devices and filters such as bulk acoustic wave (BAW) or surface acoustic wave (SAW) devices, localized pole trimming for thin film heads (TFH) and trimming of precision thin film resistors.

The scia Trim 200 is a high volume production system and accommodates a standard semiconductor cassette handling robot. Cluster tools with two process chambers and two cassette load-locks are available.

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Scia Systems – Ion Beam Deposition Systems – scia Coat 200 & scia Coat 500

Scia Systems – Ion Beam Etching Systems – scia Mill 150 et 200

Scia Systems – Ion Beam Trimming – scia Trim 200

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Scia Systems – Ion Beam Deposition Systems – scia Coat 200 & scia Coat 500

Scia Systems – Ion Beam Etching Systems – scia Mill 150 et 200

Scia Systems – Ion Beam Trimming – scia Trim 200

About DKSH

Business Lines

Order Online

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