SET – ACCµRA OPTO

The ACCµRA OPTO is a flip-chip bonder that allows ± 0.5 µm accuracy. It is dedicated to low force and reflow processes. The ACCµRA OPTO combines high precision, flexibility and accessibility. It is the perfect equipment for optoelectronics and silicon photonics applications.

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Overview

Features

Specifications

Key Features

  • Accuracy ± 0.5 µm
  • Low bonding force
  • Confining gas
  • Easy to use and very flexible
  • Quick set-up of new applications
  • Small footprint and compact design

Technical Specifications

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Applications

  • Laser diode, laser bar
  • VCSEL, photo diode
  • LED
  • Prisms, lenses, mirrors
  • Micro Assembly
  • Flip-chip bonding, die bonding
  • Chip-to-chip, chip-to-substrate bonding

Key Industries

  • Optoelectronics and Silicon Photonics
SET Smart Equipment Technology

SET, Smart Equipment Technology, is a world leading supplier of High Accuracy Flip Chip Bonders and versatile Nanoimprint Lithography (NIL)…

    • TAIWAN

      10F, No. 22, Lane 407, Ti-Ding Blvd., Section 2,
      NeiHu Technology Park
      114 Taipei<br Taiwan

      +886 921 075 612

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