Essemtec – Pick-and-Place

  • CHINA

    Damien Teo, General Manager, Semiconductor & Electronics, DKSH Technology China

    DKSH (Shanghai) Ltd.
    Unit 502, No.13 Xin’an Building, 99 Tianzhou Road
    200233 Shanghai
    China

    +86 21 6482 3806

    +86 21 3367 8466

    Email

  • INDONESIA

    Maggie Yang, Assistant General Manager

    PT. DKSH Indonesia
    AIA Central 39th floor. Jalan Jenderal Sudirman Kavling 48A
    12930 Jakarta Selatan
    Indonesia

    +62 81 7988 2288

    +62 22 2988 7870

    Email

  • MALAYSIA

    Tay Tun Yong, Technical Sales & Services Manager

    DKSH Technology Sdn. Bhd.
    No. 108-B-01-08, Setia Spice Canopy, Jalan Tun Dr. Awang,
    11900 Bayan Lepas, Penang
    Malaysia

    +60 4 645 2672

    Email

  • SINGAPORE

    Kelvin Low, Senior Manager

    DKSH Singapore Pte Ltd
    625 Lorong 4 Toa Payoh, #03-00
    319519 Singapore
    Singapore

    +65 6274 1222

    +65 6273 1503

    Email

  • THAILAND

    Lau Chek Chung, General Manager, Semiconductor & Electronics, Malaysia, Thailand and Vietnam

    DKSH (Thailand) Limited
    2106 Fantree 4 Building, Sukhumvit Road,
    Phrakhanong-Tai, Phrakhanong 10260 Bangkok
    Thailand

    +66 2 639 7000

    Email

  • TAIWAN

    Ben Lin

    Taiwan

    +886 3 6578 788 ext 101‬

    Email

  • VIETNAM

    Nguyen Phan Loan Anh, Assistant Sales Manager

    DKSH Technology Co.,Ltd
    5th Floor, Viettel Complex, 285 Cach Mang Thang Tam Ward 12, District 10
    70000 Ho Chi Minh City
    Vietnam

    +84 8 38125806

    Email

  • VIETNAM

    Ly Thi Bich Duyen (Bella), Senior Supervisor

    DKSH Technology Co.,Ltd
    5th Floor, Viettel Complex, 285 Cach Mang Thang Tam Ward 12, District 10
    70000 Ho Chi Minh City
    Vietnam

    +84 8 38125806

    Email

  • Essemtec Fox Brochure


  • Essemtec Puma Brochure


Designed for even more product changes per day, an even bigger range of components, increasing requirements for placement accuracy, speed and availability combined with high quality – naturally adaptive – engineering. Most feeders per sqm in the marketplace, intelligent set-up concepts, the largest board sizes together with the most compact system sizes and the falcon software based on Essemtec`s “eez-technology“ ensure highly efficient and economical SMD manufacturing for service providers and in-house production.

Available Models

Technical Specifications

Fox 4Fox 2Fox
Productivity: optimum placement speed18,800 cph (4-axes)12,000 cph (2-axes)7,000 cph (1-axis)
Productivity: optimum jetting speed150,000 Dots/h
Feeder Capacity 8 mm Tape200 (140 inline)180 (120 inline)180 (120 inline)
Component Size Range008004 (imp.) – 80 x 80 mm(Note specs for constraints)
Placement accuracy (x, y)Chip ± 40 μm (3σ) / QFP ± 30 μm (3σ)
Max. PCB dimensions406 x 305 mm (16 x 12“)
Dimensions: machine footprint880 x 1090 mm (34.7 x 43“)

Introducing – The Fox Pack – State of the art technology. Expandable in any direction. The Fox can drive up to 200 feeder, illustrating its dedication to high-mix production. Due to its small footprint and reasonable weight, the machine is ideal for use in limited space production areas even those located on upper floors.

Technical Specifications

Puma 4Puma 2Puma
Productivity: Optimum placement speed18,100 cph (4-axes)11,200 cph (2-axes)6,700 cph (1-axis)
Productivity: Optimum jetting speedSystem 180,000 dots/h – Valve 720,000 dots/hSystem 180,000 dots/h – Valve 720,000 dots/h
Feeder capacity 8 mm Tape280 (160 inline)260 (140 inline)260 (140 inline)
Component size range008004 (imp.) – 80 x 80 mm(Note specs for details)
Placement accuracy (x, y)Chip ± 40 μm (3σ) / QFP ± 30 μm (3σ)
Max. PCB dimensions560 x 610 mm (22 x 24“)optional 1,800 x 610 mm (71 x 24“)
Dimensions: Machine footprint1,557 x 1,357 mm (61 x 53“)

Introducing – The Puma – State of the art technology. Expandable in any direction. Same as in nature our Puma is common modular and adaptive in all kinds of environment. With different modules the systems grow synchronously with the customer’s requirements for performance and processes. Puma is world`s best highspeed Pick-and-Place solution which can also be used in ultraflexible, rapid prototyping development.

Key Features

Fox Puma
Combined Process.Placing & dispensing in single pass-through
.Jet dispensing of solder paste or glue
.Highspeed placing and dispensing in single pass-through
.1, 2 or 4 placement-axes and 1-2 dispense processes
Productivity.Up to 1000 – 18,800 cph per module
.Up to 56,400 cph per line (3 modules)
.Optimum 18,100 cph, up to 54,300 cph inline
.Optimum jetting speed 180,000 – 720,000 dots/h
Small Footprint.Up to 200 feeder lanes on 1 sqm
.Up to 420 feeder lanes per line
.Up to 280 Feeder on 2 ㎡ (up to 420 inline)
.PCB size 560 x 610 mm, optional 1800 x 610 mm
Mineral Cast.No vibration, symmetrical mineral casting
.No warpage, no thermal drift
.No vibration, symmetrical mineral casting
.No warpage, no thermal drift
Quick Changeover.Nonstop production, intelligent smart feeder
.Nonstop feeder and production changeover
.Nonstop production, intelligent smart feeder
.Nonstop feeder and production changeover
Linear Motors.Fast, reliable double drive linear motors
.No maintenance, longest lifetime
.Fast, reliable double drive linear motors
.No maintenance, longest lifetime

Essemtec Application – Puma and Fox on the Hunt

Application clip of our Pick-and-Place “beasts” Fox and Puma. All Scenes from our product videos raw in real-time. No fast-forward, no effects, no post stabilisation.

Essemtec – Puma 

Relentless High Speed Pick-and-Place and Dispensing

Puma is worlds first high-speed pick and place solution that can be also used in the ultra-flexible prototyping development sector. 

Key Industries

  • Semiconductor, Solar & Electronics

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