Scia Systems – Ion Beam Etching Systems – scia Mill 150 et 200
The scia Mill 150 is designed for highly uniform Ion Beam Etching and Milling of single substrates up to 150 mm diameter. Carriers or wafers are loaded via an automatic handling system. The substrate holder has helium backside cooling and …
The scia Mill 150 is designed for highly uniform Ion Beam Etching and Milling of single substrates up to 150 mm diameter. Carriers or wafers are loaded via an automatic handling system. The substrate holder has helium backside cooling and can be tilted and rotated. Typical applications are the structuring of metal films for MEMS and sensors.
The scia Mill 200 is designed for highly uniform Ion Beam Etching and Milling of wafers up to 200 mm diameter. Carriers or wafers are loaded via an automatic handling system.
