The NorCom 2020 provides automated in line, full matrix leak testing of hermetically sealed microelectronic and optoelectronic devices. It eliminates the need for helium mass spectroscopy and gross leak bubble testing by utilizing a patented laser interferometer to simultaneously measure gross and fine leaks in hermetic devices.

Since the reliability of hermetic electronic packages is dependent on the detection of gross and fine leaks, the NorCom 2020’s pinpoint accuracy, repeatability and increased production throughput make the system an essential requirement for hermetic device production.

Key Features

• High Throughput
• Automatic In-line Leak Detection
• Clean and Safe Procedure

Next-generation and time-tested capabilities are combined in this upgraded system to increase productivity by up to 50% over the top-selling Spectrum^® ll, all in a space-saving footprint.

SPHERE series systems support automated handling and processing of round or square wafer/substrate sizes ranging from 75mm to 300mm. In addition, thin wafer processing with or without carriers is possible, depending upon wafer thickness.

The patented plasma chamber design provides exceptional etch uniformity and process repeatability. Primary plasma applications include a variety of etching, ashing, and descum steps. Other plasma processes include contamination removal, surface roughening, increasing wettability, and enhancing bonding and adhesion strength, photoresist/polymer stripping, dielectric etch, wafer bumping, organic contamination removal, and wafer destress.

• Wafer Cleaning – The SPHERE series plasma systems remove contamination prior to wafer bumping, remove organic contamination, remove fluorine and other halogen contamination, and remove metal and metal oxides. Plasma also improves spun-on film adhesion and cleans metallic bond pads.
• Wafer Etching – Plasma systems descum wafer of residual photoresist and BCB, pattern dielectric layers for redistribution, strip/etch photoresist, enhance adhesion of wafer applied materials, remove excess wafer applied mold /epoxy, enhance adhesion of gold solder bumps, destress wafer to reduce breakage, improve spun-on film adhesion, and clean aluminum bond pads.

The original manufacturing method enhances adhesiveness between porous sections and base sections to achieve sufficient flatness even at boundary sections.

We can provide highly productive and reliable wafer thinning processing and manufacturing requiring whole surface absorption of large sized substrates.

We offer a wide selection of porous bodies with using different materials and pore sizes to cater to user needs.

This unit is used for loading of substrates, leadframes or carriers.

This unit is used for restacking of PCBs from the production line.