Lissmac – Metal processing machine – SBM 900 S2
Lissmac – Slag removing machine – SBM-M D2
LISSMAC systems for metal processing set benchmarks in innovative sheet metal processing through highly-effective, two-sided removal of slag on plasma and thermal cut workpieces using only one work process. Unlike grinding machines, SBM-M D2s win …
LISSMAC systems for metal processing set benchmarks in innovative sheet metal processing through highly-effective, two-sided removal of slag on plasma and thermal cut workpieces using only one work process. Unlike grinding machines, SBM-M D2s win over customers with more efficient processing work savings of up to 60%. Tool costs are significantly reduced in comparison to expensive machining with abrasives due to mechanical removal of the slag.
Lissmac – Steel brushing machine – SBM-M B2
LISSMAC systems for metal processing set benchmarks in innovative sheet metal processing through highly-effective, two-sided removal of oxide layers on lasered sheets using only one work process. Unlike brush machines, SBM-M B2s win over customers…
LISSMAC systems for metal processing set benchmarks in innovative sheet metal processing through highly-effective, two-sided removal of oxide layers on lasered sheets using only one work process. Unlike brush machines, SBM-M B2s win over customers with more efficient processing work savings of up to 60%.
Microtrac – Dynamic Light Scattering (DLS) – Nanotrac Flex
Microtrac MRB’s NANOTRAC Flex is a highly flexible nanoparticle size analyzer based on Dynamic Light Scattering (DLS) which provides information on particle size, concentration, and molecular weight. It allows faster measureme…
Microtrac MRB’s NANOTRAC Flex is a highly flexible nanoparticle size analyzer based on Dynamic Light Scattering (DLS) which provides information on particle size, concentration, and molecular weight. It allows faster measurements with reliable technology, higher precision, and better accuracy. All of this combined into compact a DLS analyzer with a revolutionary fixed optical probe.
With the unique and flexible probe design and the use of the Laser Amplified Detection method in the NANOTRAC FLEX, the user is able to choose an appropriate vessel as a measurement cell to satisfy the needs of any application. This design also allows measurements of samples over a wide concentration range, monomodal or multimodal samples, all without prior knowledge of the particle size distribution. This is made possible through the use of the Frequency Power Spectrum (FPS) method instead of classical Photon Correlation Spectroscopy (PCS).
Microtrac – Dynamic Light Scattering (DLS) – Nanotrac Wave Series
Microtrac MRB’s NANOTRAC Wave II / Q / Zeta is a highly flexible Dynamic Light Scattering (DLS) analyzer which provides information on particle size, zeta potential, concentration, and molecular weight. It allows faste…
Microtrac MRB’s NANOTRAC Wave II / Q / Zeta is a highly flexible Dynamic Light Scattering (DLS) analyzer which provides information on particle size, zeta potential, concentration, and molecular weight. It allows faster measurements with reliable technology, higher precision, and better accuracy. All of this combined into a compact DLS analyzer with a revolutionary fixed optical probe.
With the unique and flexible probe design and the use of the Laser Amplified Detection method in the NANOTRAC Wave II / Q / Zeta, the user is able to choose from a wide array of measurement cells that satisfy the needs of any application. This design also allows measurements of samples over a wide concentration range, monomodal or multimodal samples, all without prior knowledge of the particle size distribution. This is made possible through the use of the Frequency Power Spectrum (FPS) method instead of classical Photon Correlation Spectroscopy (PCS).
Microtrac – Laser Diffraction – SYNC
A New Dimension in Particle Analysis
With the SYNC particle analyzer, Microtrac MRB integrates its highly accurate tri-laser diffraction analyzer technology with its versatile dynamic i…
A New Dimension in Particle Analysis
With the SYNC particle analyzer, Microtrac MRB integrates its highly accurate tri-laser diffraction analyzer technology with its versatile dynamic image analysis capability to provide particle characterization practitioners with a unique measuring experience. The patented synchronous measurement technology allows users to make both a laser diffraction measurement and an image analysis measurement on a single sample, in the same sample cell at the same time
- One sample
- One optical bench
- One flow path
- One sample cell
- One analysis
The SYNC laser diffraction particle size analyzer is ideally suited for routine QC applications. It also provides valuable information to researchers as they develop new materials and processes. The powerful analyzer software provides both particle size distribution information as well as a multitude of morphological particle parameters. The patented BLEND routine allows users to examine materials over a wide range of sizes from 0.01 microns to 4000 microns.
Midas – D5 Series de-idder™
A massive flat-rail and carriage module replaced the decades old round rail system. Chassis structure was heavily reinforced with interlocked walls and castings. Table drive is the servomotor system used on the DL-4A; with datum…
A massive flat-rail and carriage module replaced the decades old round rail system. Chassis structure was heavily reinforced with interlocked walls and castings. Table drive is the servomotor system used on the DL-4A; with datum offset and home run features. Upgraded cutter motors and drive geometry give over 8000 max RPM at the spindle.
Midas – Hot Gas Rework System
The HGRS-V is a highly adaptable dual-jet “thermal workbench” with a comprehensive suite of circuit-protective features. It’s the ideal solution for those facing a variety of rework tasks involving large die, eutectic attach, double-sided devices or other assemblies with tight thermal constraints.
Nanotech – CNC coordinate grinding machine – 1280
The Moore Tool Company, a leader in precision machine tool design and manufacture, produces a complete line of jig grinding machines and accessories.
The 1280 Series Jig Grinder is available in three models (CPZ, CPZ-E an…
The Moore Tool Company, a leader in precision machine tool design and manufacture, produces a complete line of jig grinding machines and accessories.
The 1280 Series Jig Grinder is available in three models (CPZ, CPZ-E and CPWZ)to address your specific precision grinding requirements. These CNC-controlledjig grinding machines have multiple, programmable axes (four simultaneouslycontrolled) for complex two- and three-dimensional features.
Nanotech – CNC coordinate grinding machine – 500
The Moore Tool Company, a leader in precision machine tool design andmanufacture, produces a complete line of jig grinding machines and accessories.
The 500 Series Jig Grinder is available in three models (CPZ, CPZ-E and …
The Moore Tool Company, a leader in precision machine tool design andmanufacture, produces a complete line of jig grinding machines and accessories.
The 500 Series Jig Grinder is available in three models (CPZ, CPZ-E and CPWZ)to address your specific precision grinding requirements. These CNC-controlled jig grinding machines have multiple, programmable axes (four simultaneously controlled) for complex two- and three-dimensional features.
Nanotech – Diamond Turning Lathe – 250UPL, 450UPL
250UPL Compact Diamond Turning Lathe.
Simple to use and engineered for high productivity. Our latest generation of the most user friendly and compact ultra-precision CNC diamond turning lathe. Used for the rapid production …
250UPL Compact Diamond Turning Lathe.
Simple to use and engineered for high productivity. Our latest generation of the most user friendly and compact ultra-precision CNC diamond turning lathe. Used for the rapid production of spherical & aspheric optical lenses, mirrors, mold inserts, freeform optics, and even mechanical components. If your application fits within a 350mm diameter window (with optional riser package), this machine may be the ideal solution for your ultra precision needs. Achieves both sub-nanometer level surface finishes and sub-micron form accuracies directly off the machine in a wide variety of materials.
450UPL Midsize Diamond Turning Lathe.
Only Nanotech offers a proven and established midsize ultra precision system. The 450UPLv2 is comfortably suitable for both single point diamond turning and deterministic micro-grinding of optical elements. Applications examples include the manufacture of components used in a wide variety of markets such as electro-optics, aerospace, defense, consumer electronics, bearing, and computer industries. As an ideal midsize option for our customers, the standard configuration of this popular machine model yields a 450mm diameter swing capacity, but increased swing capabilities are readily available upon request.
Nanotech – Diamond Turning Lathe – 650FGv2
most versatile freeform generator
This latest generation of our true flag ship machine has been proven worldwide to be the most flexible, precise, and user friendly ultra precision freeform diamond turning system available….
most versatile freeform generator
This latest generation of our true flag ship machine has been proven worldwide to be the most flexible, precise, and user friendly ultra precision freeform diamond turning system available. With a minimum of three precision linear X, Y, and Z axes, the 650FGv2 is expandable to a five-axis system via optional B & C rotary axes. With the main work spindle centrally integrated within an oil hydrostatic Y-axis carriage, advanced machining methods such as raster flycutting of linear diffractives and freeforms, micro-prismatic optical structures, micro-milling of aspheric lens arrays as well as Slow Slide Servo (S3) machining of toric, biconic surfaces are achievable.
NanoSMART® Windows Based Interactive HMI Control System
A high speed 64 bit Delta Tau PowerPMAC Motion Controller with the Nanotech’s own touch / swipe gesture HMI, NanoSMART. Three customizable 22″ wide screens are accessible by swiping left or right from the main screen. Ability to handle 5GB program file sizes, 4X faster processing speeds, remote diagnostics and a leading 8 picometer feedback resolution combine to make the new Nanotech 650FGv2 the most user friendly high performance multi-axis diamond turning system available. We welcome you to experience the difference for yourself!
Nanotech – Drum type turning lathe – HDL2000
This machine is available in two versions: the HDL2000-SD and HDL2000-HD. These are extra large capacity ultra-precision machining systems used for single point diamond turning advanced optical surfaces along the diameter of large generation drums…
This machine is available in two versions: the HDL2000-SD and HDL2000-HD. These are extra large capacity ultra-precision machining systems used for single point diamond turning advanced optical surfaces along the diameter of large generation drums. This machine accepts drums up to 650mm diameter and 3100mm long (between chuck faces) with a weight capacity of 1800 Kg (3000 Kg on HD version). Maximum optical cutting zone length is 2600mm.
Nanotech – Glass molding press – 140GPM
The Nanotech 140GPM is a glass press molding machine designed for precision glass optic applications. It features a single molding chamber with a 140mm diameter capacity. This machine compliments the Nanotech 100UPG which is ideal for ultra precis…
The Nanotech 140GPM is a glass press molding machine designed for precision glass optic applications. It features a single molding chamber with a 140mm diameter capacity. This machine compliments the Nanotech 100UPG which is ideal for ultra precision grinding of WC and SiC mold components. The Nanotech 450UPL or 650FG can also be configured for ultra precision grinding of these molds. Together, the combination of systems forms an ultra precision glass press molding cell.
Nanotech – Grinding machine – 100UPGv1
Ultra-Precision Aspheric Grinding System.
The Nanotech 100UPGv1 is an aspheric ultra-precision grinding system specifically engineered for grinding of Tungsten Carbide and Silicon Carbide aspheric optical mold inserts used …
Ultra-Precision Aspheric Grinding System.
The Nanotech 100UPGv1 is an aspheric ultra-precision grinding system specifically engineered for grinding of Tungsten Carbide and Silicon Carbide aspheric optical mold inserts used in glass press molding as well as grinding of aspheric glass lenses. It is also suitable for single point diamond turning of symmetric optical components. The system is available in either a XZ or XZB configuration. It provides a 100mm diameter swing capacity for grinding applications and a 250mm diameter capacity for diamond turning.
Nanotech – Grinding Machine – 400UPJGv1
Ultra Precision Jigs Grinder
Introducing our next generation jig grinding center with accuracies and repeatability beyond what is available from any other system. Built upon many proven principles used in our leading single…
Ultra Precision Jigs Grinder
Introducing our next generation jig grinding center with accuracies and repeatability beyond what is available from any other system. Built upon many proven principles used in our leading single point diamond turning systems, the 400UPJG was engineered and constructed to achieve true ultra-precision sub-micron tolerances. It offers both high productivity and advanced operating simplicity.
NanoSMART® Interactive HMI Control System
The system is powered by a high speed 64 bit Delta Tau PowerPMAC motion controller and a touch / swipe gesture “smart” screen display. Our exlusive HMI software, NanoSMART, consists of three customizable 22″ wide screens that are accessible by swiping left or right from the main screen, keeping all the information you need at your finger tips. The customization capability allows the user to now manage their programming and monitoring preferences while a fully integrated jig-grinding cycle routine mimics the operation of traditional jig-grinders. Our proprietary software and control system boasts a 10 nanometer (0.00001mm) programming resolution with a 1.0 nanometer (0.000001mm) feedback resolution.
Nanotech – Milling machine – 350UPM
Contact Us Beijing26th Floor, West Tower, Hanwei PlazaNo.7 Guanghua Road, Chaoyang District, BeijingTEL: 010-6561 3988FAX: 010-6561 0278http://dksh-machinery.com ShanghaiRoom Unit 605-607, Build 2, Xinglian Building,No.1535 Hongmei Road, Xuhui District, ShanghaiTEL: 021-5383 8811FAX: 021-3367 8466http://dksh-machinery.com ChengduRoom 802, 8/F, Tower 1, Central PlazaNo.8 Shuncheng Street, ChengduTEL: 028-8676 1111FAX: 028-8676 1122http://dksh-machinery.com GuangzhouRoom 1213-1215, 12/F Jie Tai Plaza,218-222 Zhongshan Road…
Nordson EFD – 3-Axis EV Series Automated Fluid Dispensing Robot
The EV Series automated fluid dispensing system is a tabletop robot that offers easy automation for precise fluid applications, featuring proprietary dispensing software and a simple vision pencil camera. The EV Series can function as a standal…
The EV Series automated fluid dispensing system is a tabletop robot that offers easy automation for precise fluid applications, featuring proprietary dispensing software and a simple vision pencil camera. The EV Series can function as a standalone system or as a key component in an automated solution. It integrates easily into in-line transfer systems, rotary tables, and pallet assembly lines.
- Precision Fluid Dispensing:
Uses EFD syringe barrel and valve systems with vision-guided DispenseMotion™ software and a pencil camera for easy setup and programming.
- Advanced Motion Control:
True three-dimensional motion control for dots, lines, circles, arcs, and compound arcs.
- Versatile Platforms:
Platform sizes from 150 x 200 mm to 570 x 500 mm, suitable for batching and critical dispensing applications.
Nordson EFD – HPx High-Pressure Dispensing Tool
HPx High-Pressure Dispensing Tool easily apply precise amounts of thick assembly fluids like epoxies and medical-grade adhesives through dispense tips as small as 0.004” with Nordson EFD HPx™ dispensing tools. Featuring a unique design, HPx to…
HPx High-Pressure Dispensing Tool easily apply precise amounts of thick assembly fluids like epoxies and medical-grade adhesives through dispense tips as small as 0.004” with Nordson EFD HPx™ dispensing tools. Featuring a unique design, HPx tools increase the pressure inside disposable syringe barrels up to seven times. Designed to work with Nordson EFD air-powered dispensers, they produce a maximum dispensing pressure of 700 psi. Increase yields and produce better quality parts in less time, while minimizing the risk of repetitive stress injuries.
Nordson Electronics Solutions – Automated Plasma Treatment System – FlexTRAK® SHS
Industry-Leading Throughput and Reliability
Built upon Nordson Electronics Solutions’ patented plasma technology, the FlexTRAK®-SHS is our latest fully automated plasma system incorporating a high-capacity F3-S chamber, to provide …
Industry-Leading Throughput and Reliability
Built upon Nordson Electronics Solutions’ patented plasma technology, the FlexTRAK®-SHS is our latest fully automated plasma system incorporating a high-capacity F3-S chamber, to provide high uniformity and increased productivity. The chamber architecture remains the same as the smaller FlexTRAK platform, providing a seamless transition between chambers as production demands more capacity.
Key Applications
- Pre-wire bond plasma treatment on semiconductor package substrates and lead frames
- Pre-underfill plasma treatment on flip chip packages
- Pre-mold plasma treatment on semiconductor package substrates and lead frames
- Plasma treatment of semiconductor package substrates and lead frames for improved adhesion
- Removal/reduction of oxidation on lead frame
Nordson Electronics Solutions – Plasma Polymerization Deposition System – PD Series
Nordson Electronics Solutions introduces its PD Series Plasma Deposition Systems family, which uses plasma polymerization to deposit thin films uniformly during precision manufacturing and assembly processes to change the surfac…
Nordson Electronics Solutions introduces its PD Series Plasma Deposition Systems family, which uses plasma polymerization to deposit thin films uniformly during precision manufacturing and assembly processes to change the surface characteristics of a substrate. Plasma deposition can be used for applications in a wide range of industries, including medical, life sciences, industrial, semiconductor, MEMS, plastics, and electronics.
The PD Series for plasma deposition uses a gas vapor or heated liquid monomer vapor delivery system to deposit coatings that can reduce, and in certain cases eliminate, tackiness, provide a tie layer, make surfaces more slippery or resistant to corrosion, act as a drug enhancement or inhibition agent in life sciences applications, and change desired surfaces from hydrophobic to hydrophilic or vice versa. Polymers can be directly attached to a desired surface while the chains are growing, which reduces the steps necessary for other coating processes such as grafting. This is very useful for pinhole-free coatings of 100 picometers to 1 micrometer thickness with solvent insoluble polymers.
Key Features
-
Low-temperature processing because plasma energy is the catalyst for film growth.
- Plasma deposition is uniform and applies coatings evenly over curved or varied-level surfaces.
- Precise control of film thickness.
- Eliminates wet chemistry. Because polymers are deposited directly from the monomer, there are no waste streams due to wet chemical synthesis or solvents.
- Exhibits similar properties to those created via standard chemical polymerization techniques.
- Can be used in multiple steps during device manufacture: pre-treat the surface, deposit material, and apply functionalized polymer films.
Nordson Electronics Solutions – Plasma Systems – Sphere Series
SPHERE series systems support automated handling and processing of round or square wafer/substrate sizes ranging from 75mm to 300mm. In addition, thin wafer processing with or without carriers is possible, depending upon wafer t…
SPHERE series systems support automated handling and processing of round or square wafer/substrate sizes ranging from 75mm to 300mm. In addition, thin wafer processing with or without carriers is possible, depending upon wafer thickness.
The patented plasma chamber design provides exceptional etch uniformity and process repeatability. Primary plasma applications include a variety of etching, ashing, and descum steps. Other plasma processes include contamination removal, surface roughening, increasing wettability, and enhancing bonding and adhesion strength, photoresist/polymer stripping, dielectric etch, wafer bumping, organic contamination removal, and wafer destress.
- Wafer Cleaning – The SPHERE series plasma systems remove contamination prior to wafer bumping, remove organic contamination, remove fluorine and other halogen contamination, and remove metal and metal oxides. Plasma also improves spun-on film adhesion and cleans metallic bond pads.
- Wafer Etching – Plasma systems descum wafer of residual photoresist and BCB, pattern dielectric layers for redistribution, strip/etch photoresist, enhance adhesion of wafer applied materials, remove excess wafer applied mold /epoxy, enhance adhesion of gold solder bumps, destress wafer to reduce breakage, improve spun-on film adhesion, and clean aluminum bond pads.
Nordson Electronics Solutions – Vacuum Plasma Treatment Systems – AP Series
AP series plasma treatment machines are suitable for a wide variety of plasma cleaning, surface activation and adhesion improvement applications. These capabilities are used for semiconductor manufacturing, microelectronic packa…
AP series plasma treatment machines are suitable for a wide variety of plasma cleaning, surface activation and adhesion improvement applications. These capabilities are used for semiconductor manufacturing, microelectronic packaging and assembly, and by manufacturers of medical and life science devices. The AP Series consists of four batch plasma treatment systems offering small, mid-size and large vacuum chamber options that deliver process correlation, controller continuity and reliable, reproducible vacuum gas plasma treatment to customers as they expand from an R&D environment to various levels of production.
