LINEXO is a versatile laser processing workstation designed for high-precision applications in the electronic, precision engineering, and photovoltaic industries. It is often used in R&D environments, as well as production of smaller substrates as e.g. ceramic PCBs.

Keeping items and available space structured and organized minimizes search times and streamlines even the most complex work processes.

To achieve this, Kardex designed a wide range of special storage & transport boxes to meet every customer need. 

Benefits At A Glance

• Change the layout easily

  You won’t regret your decision when buying a Kardex Box. While competitor boxes require additional investments when storage demands change, you can easily rebuild and add to Kardex Boxes as needed over time.

• Create a positive working environment

  Kardex Boxes offer a low noise level compared to other solutions. They prevent potential crashes within the system by stabilizing goods on the tray.

• Store more than before

  The Kardex Box itself weighs very little because it is made from lightweight materials. This means you can load the tray with more goods than comparable box solutions allow. Its intelligent dividing system also maximizes space.

The Kardex Miniload-in-a-Box* is part of the product family Vertical Buffer Module (VBM) and provides solutions for fast-growing product ranges with limited storage space. The system uses a lightweight mini-load crane with a telescopic gripper to individually transport bins or trays to the access opening point.

The Kardex Compact Buffer is a Vertical Buffer Module (VBM) that provides an efficient solution for fast-growing product ranges with limited storage space.

This scalable bin solution works as a mini-load system and flexibly stores, picks and buffers small parts. With the recently launched version, capable of extending up to 20 meters, the Kardex Compact Buffer provides valuable benefits. It allows companies to maximize space by utilizing the storage area at a minimal cost.

Pick small parts quickly and efficiently with the Kardex Compact Buffer (formerly LR 35)

To optimize order picking performance for small parts and lightweight goods, the Kardex Compact Buffer (formerly LR 35) is the ideal solution. Whether being used to supply a production line with a wide range of products; as buffer storage in the assembly area; or for picking slow-moving parts in the distribution warehouse, the Kardex Compact Buffer (formerly LR 35) significantly improves productivity, while guaranteeing accuracy and energy efficiency.

It is flexible and scalable. A work station can consist of one or more units. Companies benefit from optimal storage capacity and performance. They choose from several access opening types and can customize the unit dimensions up to 20 meters long and 12 meters high. This flexibility makes the Kardex Compact Buffer (formerly LR 35) an ideal solution for multiple applications. It easily integrates into existing processes and connects to different customer host-systems.

The importance of ergonomic picking is growing. Customers working with the Kardex Compact Buffer (formerly LR 35) benefit from ergonomic work stations, which simplify the picking process and improve overall working conditions. At each access opening, items tilt at a 20-degree angle while the goods-to-person principle delivers items directly to the operator, eliminating walk and search time.

PEER Group® provides the largest portfolio of equipment connectivity and automation software products to equipment makers (OEMs) in the semiconductor and related industries. With over 100,000 licenses shipped, PEER Group is the leading supplier of factory automation software for Smart Manufacturing and Industry 4.0.

The ACCµRA OPTO is a flip-chip bonder that allows ± 0.5 µm accuracy. It is dedicated to low force and reflow processes. The ACCµRA OPTO combines high precision, flexibility and accessibility. It is the perfect equipment for optoelectronics and silicon photonics applications.

NEO HB is a flip-chip bonder designed for ± 1 µm @ 3σ accuracy in stand-alone or full automatic mode (EFEM). It is suitable for Hybrid/Direct bonding processes. NEO HB combines high precision, flexibility and short cycle time. It is dedicated for production.

Applications

• Hybrid / Direct bonding (room temperature)
• Flip-chip bonding, die bonding
• Chip-to-wafer, wafer level applications
• Chip-to-substrate bonding
• Pick & Place
• Memory stacking
• 3D IC