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Showing 1–24 of 28 results

Essemtec – Dispensing
Equipped with the most modern, accurate systems that drive and steering technology offers today. Mediums rarely behave the same way, environmental conditions are significant for the behavior of liquid changes. This is why there is virtually no sta…

Equipped with the most modern, accurate systems that drive and steering technology offers today. Mediums rarely behave the same way, environmental conditions are significant for the behavior of liquid changes. This is why there is virtually no standard application in dispensing.

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Essemtec – Pick-and-Place
Designed for even more product changes per day, an even bigger range of components, increasing requirements for placement accuracy, speed and availability combined with high quality – naturally adaptive – engineering.

Designed for even more product changes per day, an even bigger range of components, increasing requirements for placement accuracy, speed and availability combined with high quality – naturally adaptive – engineering.

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InnoLas Solutions – Linear Table Machine – LINEXO
LINEXO is a versatile laser processing workstation designed for high-precision applications in the electronic, precision engineering, and photovoltaic industries.

LINEXO is a versatile laser processing workstation designed for high-precision applications in the electronic, precision engineering, and photovoltaic industries.

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InnoLas Solutions – Split Axis Machine – EXPEGO
Versatile Laser System for Micro Material Processing

EXPEGO is a laser processing workstation designed for high-precision applications in the electronic, precision engineering, and phot…

Versatile Laser System for Micro Material Processing

EXPEGO is a laser processing workstation designed for high-precision applications in the electronic, precision engineering, and photovoltaic industries. It is mainly used for microvia drilling, cutting (routing), structuring and cavity formation in PCBs with typical dimensions as 610 x 460 mm and 635 x 540 mm.

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InnoLas Solutions – Split Axis Machine – ULTAGO
Powerful Laser System for Micro Material Processing

ULTAGO is a powerful laser processing workstation designed for high-precision applications in the photovoltaic, precision engineering, and electronic in…

Powerful Laser System for Micro Material Processing

ULTAGO is a powerful laser processing workstation designed for high-precision applications in the photovoltaic, precision engineering, and electronic industries. It achieves maximum throughput for solar cells or ceramic substrates and is used in high-volume production environments. Different from linear table machines, in the turntable machine loading, unloading, alignment, as well as laser processing are carried out in parallel in order to reach optimum productivity.

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Kardex – Accessories
Keeping items and available space structured and organized minimizes search times and streamlines even the most complex work processes.

To achieve this, Kardex designed a wide range of special storage & transport boxes to meet every cu…

Keeping items and available space structured and organized minimizes search times and streamlines even the most complex work processes.

To achieve this, Kardex designed a wide range of special storage & transport boxes to meet every customer need.

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Kardex – Heavy Duty Units
Kardex In Association with Intertex.

The TowerMat and InterMat heavy-duty units are ideal solutions for companies that want to store oversized and extremely heavy goods in an efficient, safe, and compact manner.

Kardex In Association with Intertex.

The TowerMat and InterMat heavy-duty units are ideal solutions for companies that want to store oversized and extremely heavy goods in an efficient, safe, and compact manner.

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Kardex – Horizontal Carousel Module
Use the Horizontal Carousel Module (HCM) to store and retrieve goods quickly, reliably, and cost-effectively.

Use the Horizontal Carousel Module (HCM) to store and retrieve goods quickly, reliably, and cost-effectively.

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Kardex – Miniload-in-a-Box
The Kardex Miniload-in-a-Box* is part of the product family Vertical Buffer Module (VBM) and provides solutions for fast-growing product ranges with limited storage space. The system uses a lightweight mini-load crane with a telescopic gripper to …

The Kardex Miniload-in-a-Box* is part of the product family Vertical Buffer Module (VBM) and provides solutions for fast-growing product ranges with limited storage space. The system uses a lightweight mini-load crane with a telescopic gripper to individually transport bins or trays to the access opening point.

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Kardex – Software and Control Solutions
Efficient and reliable warehouse management software solutions are as important for the productivity of modern warehouses as hardware components.

Efficient and reliable warehouse management software solutions are as important for the productivity of modern warehouses as hardware components.

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Kardex – Vertical Buffer Module
The Kardex Compact Buffer is a Vertical Buffer Module (VBM) that provides an efficient solution for fast-growing product ranges with limited storage space.

This scalable bin solution works as a mini-load system and flexibly stores, picks an…

The Kardex Compact Buffer is a Vertical Buffer Module (VBM) that provides an efficient solution for fast-growing product ranges with limited storage space.

This scalable bin solution works as a mini-load system and flexibly stores, picks and buffers small parts. With the recently launched version, capable of extending up to 20 meters, the Kardex Compact Buffer provides valuable benefits. It allows companies to maximize space by utilizing the storage area at a minimal cost.

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Kardex – Vertical Carousel Module
The new Kardex Megamat is an automated carousel which rotates vertically around a track to bring stored inventory to an operator.

The new Kardex Megamat is an automated carousel which rotates vertically around a track to bring stored inventory to an operator.

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Kardex – Vertical Lift Module
The Vertical Lift Module (VLM) from Kardex features an enclosed shelf-based storage system designed to increase capacity in a more compact footprint.

The Vertical Lift Module (VLM) from Kardex features an enclosed shelf-based storage system designed to increase capacity in a more compact footprint.

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Kardex – Office Solution Kardex Megamat 115 / 120 (Formerly Lektriever)
The Kardex Megamat 115 / 120 (formerly Lektriever) is a software-controlled automated media storage and retrieval system that holds thousands of media files, videos, CDs, DVDs, or a host of other media.

The Kardex Megamat 115 / 120 (formerly Lektriever) is a software-controlled automated media storage and retrieval system that holds thousands of media files, videos, CDs, DVDs, or a host of other media.

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PEER Group Equipment Automation Software for OEMs
PEER Group® provides the largest portfolio of equipment connectivity and automation software products to equipment makers (OEMs) in the semiconductor and related industries. With over 100,000 licenses shipped, PEER Group is the leading supplier o…

PEER Group® provides the largest portfolio of equipment connectivity and automation software products to equipment makers (OEMs) in the semiconductor and related industries. With over 100,000 licenses shipped, PEER Group is the leading supplier of factory automation software for Smart Manufacturing and Industry 4.0.

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PEER Group Factory Automation Software
PEER Group® provides the largest portfolio of factory automation software products and services to high-volume manufacturers in the semiconductor and related industries. With over 100,000 licenses shipped, PEER Group is the leading supplier of fa…

PEER Group® provides the largest portfolio of factory automation software products and services to high-volume manufacturers in the semiconductor and related industries. With over 100,000 licenses shipped, PEER Group is the leading supplier of factory automation software for Smart Manufacturing and Industry 4.0.

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SET – ACCµRA M

The ACCµRA M is a manual flip-chip bonder that allows ± 3 µm accuracy. This equipment permits to align manually the components with a high level of precision. The motorized arm controls precisely the bonding force. Combining and synchronizing the arm with the temperature controller, it guarantees a perfect quality and high repeatability of your process. The ACCµRA M, more than a pick-and-place system, offers thermocompression and reflow capabilities. It is the perfect equipment for universities and R&D institutes.

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SET – ACCµRA OPTO
The ACCµRA OPTO is a flip-chip bonder that allows ± 0.5 µm accuracy. It is dedicated to low force and reflow processes. The ACCµRA OPTO combines high precision, ﬂexibility and accessibility. It is the perfect equipment for optoelectronics an…

The ACCµRA OPTO is a flip-chip bonder that allows ± 0.5 µm accuracy. It is dedicated to low force and reflow processes. The ACCµRA OPTO combines high precision, ﬂexibility and accessibility. It is the perfect equipment for optoelectronics and silicon photonics applications.

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SET – ACCµRA Plus
ACCµRA Plus is a flip-chip bonder designed for ± 0.5 µm accuracy in full automatic mode. It is suitable for reflow and thermocompression processes.

ACCµRA Plus combines high pr…
ACCµRA Plus is a flip-chip bonder designed for ± 0.5 µm accuracy in full automatic mode. It is suitable for reflow and thermocompression processes.

ACCµRA Plus combines high precision, flexibility and short cycle time. It is dedicated to production for Optoelectronic and Silicon photonics applications.
Applications

Laser diode, laser bar

VCSEL, photo diode

LED

Prisms, lenses, mirrors

Micro Assembly

Flip-chip bonding, die bonding

Chip-to-chip, chip-to-substrate bonding
Industries

Optoelectronics and Silicon Photonics
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SET – ACCµRA100
The ACCµRA100 is a flip-chip bonder that allows ± 0.5 µm accuracy. Motorized axes guarantee a high repeatability of your process. Its flexibility makes it ideal for developing a wide range of applications. ACCµRA100 combines…
The ACCµRA100 is a flip-chip bonder that allows ± 0.5 µm accuracy. Motorized axes guarantee a high repeatability of your process. Its flexibility makes it ideal for developing a wide range of applications. ACCµRA100 combines high precision, accessibility and cost-effectiveness. It is the perfect equipment for universities and R&D institutes.

Applications
- Micro assembly
- Laser diode, laser bar
- VCSEL, photo diode
- LED
- Flip-chip bonding, die bonding
- Chip-to-chip, chip-to-substrate bonding
- MOEMS, MEMS, MCM packaging…
- 3D packaging
- Nanoimprinting (UV NIL and Hot Embossing)
Industries
- Semiconductors
- Memory
- Optoelectronics and Silicon Photonics
- Micro LEDs Displays
- Quantum Computing
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SET – FC150

The FC150 is an accurate and very flexible flip-chip bonder for Chip-to-Chip (up to 100 mm) and Chip-to-Wafer (up to 200 mm) applications on the same open platform.

The versatile design and the possibility to combine different processes make the FC150 ideal for developing a wide range of assembly applications including focal plane arrays and optoelectronic devices.

Perfect for advanced R&D, the FC150 is also appreciated for pilot production thanks to its full automatization.

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SET – FC300

The FC300 is a high accuracy and high force flip-chip bonder for Chip-to-Chip (up to 100 mm) and Chip-to-Wafer (up to 300 mm) applications. FC300 covers a large range of bonding forces, from 1 to 4000N. That makes it perfectly suitable for reflow and thermocompression processes.

The leveling between both components is adjusted before each bonding within 1 µradian. The parallelism adjustment, the high resolution alignment and the perfect control of all bonding parameters allow to achieve submicronic post-bond accuracy.

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SET – LDP150
The LDP150 is an electrical Press especially designed for bonding large light or radiation detectors (50 ~ 150mm). It uses compression process at room temperature (thermo-compression option available).

…
The LDP150 is an electrical Press especially designed for bonding large light or radiation detectors (50 ~ 150mm). It uses compression process at room temperature (thermo-compression option available).

A predefined gap can be achieved between two components previously pre-bonded using a high accuracy device bonder such as the SET FC150. The devices are pressed together at room temperature while preserving the initial high accuracy alignment and parallelism.

The LDP150 is able to apply pressure up to 100,000N.

Applications
- Large infrared focal plane arrays
- Military and space applications
- Large XY, UV detector
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SET – NEO HB
NEO HB is a flip-chip bonder designed for ± 1 µm @ 3σ accuracy in stand-alone or full automatic mode (EFEM). It is suitable for Hybrid/Direct bonding processes. NEO HB combines high precision, flexibility and short cycle time…
NEO HB is a flip-chip bonder designed for ± 1 µm @ 3σ accuracy in stand-alone or full automatic mode (EFEM). It is suitable for Hybrid/Direct bonding processes. NEO HB combines high precision, flexibility and short cycle time. It is dedicated for production.

Applications
- Hybrid / Direct bonding (room temperature)
- Flip-chip bonding, die bonding
- Chip-to-wafer, wafer level applications
- Chip-to-substrate bonding
- Pick & Place
- Memory stacking
- 3D IC
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