The TSM Vacuum Reflow series, including Single and Double Vacuum Reflow models, offers advanced soldering solutions for the semiconductor, solar, and electronics industries. These systems enhance productivity and ensure safety during operation.
Key Features
- Completely sealable TSM’s vacuum Reflow, dedicated compression chamber
- Transfer System without jamming PCB (technical partnership with ETC)
- Prevent PCB Drop by minimizing the gab between in/outlet entrance of conveyor in vacuum chamber
- Strengthen durability without conveyor driven roller in high temperature section
- Able to correspond with minimized vacuum chamber with embedded vacuum pump
- Reduce time of vacuuming and easily control vacuum
Available Models
Key Features
- Dramatically reduction of Solder Void
- IPCB transferring system
- Eco-friendly ultra low power consumption and high thermal insulation specification
- Standard option for high efficiency and collection system of large quantity Flux
- Heating method of up/down hot air circulation
Key Features
- Independent Twin Vacuum Reflow as the World Premier (2X Vacuum Chamber + 2X Oven + 2X PC independent operation)
- Doubled productivity compared to Single Reflow
- Completely vacuumable dedicated compression chamber of TSM’s vacuum Reflow
- Transport System without jamming PCB (ETC Technical Partnership)
- Minimize the gab of in/out conveyor to prevent PCB Drop
- Enhanced durability with none conveyor driven roller in high temperature sections
Key Industries
- Semiconductor, Solar & Electronics
TSM has been produced for Reflow Oven and Nitrogen generator with a representative model, Full Auto Soldering Machine since the…
