SET – NPS300
Optimized for the production of nanostructures, the Nano imPrinting stepper Stepper NPS300 is the first ever tool able to combine Hot Embossing and UV-NIL on a same platform. The NPS300 is able to print sub-20 nm geometries with an overlay accuracy of 250 nm, when in-situ alignment is performed. Its flexible architecture offers an excellent process reproducibility and a unique ability to pattern large areas, in a sequential step and repeat mode on wafers up to 300 mm. It enables the low cost manufacturing of large stamps featuring repeated patterns.
ÂKey Features
- Nanoimprinting lithography tool various replication processes
- Step & Repeat on wafer up to 300 mm
- Inert gas injection for faster UV-NIL process
- High accuracy, low volume and programmable fluid dispense
- Automatic stamp pick-up
- Air bearing technology and granite structure ensure long-term stability and reliability
Technical Specifications
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Applications
- Photonic devices
- High precision micro-optical arrays and gratings
- CMOS-MEMS integration
- High resolution OLED displays
- High density HDD’s for mobile storage
- Other emerging techniques
Key Industries
- Semiconductors
- Photonics
- OLED Displays
Brand
SET, Smart Equipment Technology, is a world leading supplier of High Accuracy Flip Chip Bonders and versatile Nanoimprint Lithography (NIL) solutions. For 45 years, we have been designing and manufacturing semiconductor equipment dedicated to high precision applications.
We accompany laboratories and industries of semiconductor, which look for a high precision and an important reliability in the assembly of their components in their projects, and accelerate their developments of the chips of future thanks to our robust and precise flip-chip bonders.
With Device Bonders installed worldwide, SET is globally renowned for the unsurpassed sub-micron accuracy and the flexibility of its bonders. First introduced in 1981, the Flip-chip Bonder line became the primary focus of the company in 1997. Ranging from manual loading to fully automated version, our bonders cover a wide range of bonding applications and offer the unique ability to handle and bond fragile and small components onto substrate up to 300 mm.
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