SET – NEO HB
NEO HB is a flip-chip bonder designed for ± 1 µm @ 3σ accuracy in stand-alone or full automatic mode (EFEM). It is suitable for Hybrid/Direct bonding processes. NEO HB combines high precision, flexibility and short cycle time.
Available in :
NEO HB is dedicated for production.
Key Features
- High post-bonding accuracy ± 1 µm @ 3σ
- High throughput 1,000 uph
- Stand alone or full automatic
- Cleanliness level ISO 5 stand alone
- Cleanliness level ISO 3 full automatic
- High flexibility and reliability
- Creative design
Technical Specifications
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SET – NEO HB
Key Industries
- Semiconductor, Solar & Electronics
Applications
- Hybrid / Direct bonding (room temperature)
- Flip-chip bonding, die bonding
- Chip-to-wafer, wafer level applications
- Chip-to-substrate bonding
- Pick & Place
- Memory stacking
- 3D IC
SET, Smart Equipment Technology, is a world leading supplier of High Accuracy Flip Chip Bonders and versatile Nanoimprint Lithography (NIL)…
