SET – LDP150
The LDP150 is an electrical Press especially designed for bonding large light or radiation detectors (50 ~ 150mm). It uses compression process at room temperature (thermo-compression option available).
A predefined gap can be achieved between two components previously pre-bonded using a high accuracy device bonder such as the SET FC150. The devices are pressed together at room temperature while preserving the initial high accuracy alignment and parallelism.
The LDP150 is able to apply pressure up to 100,000N.
Applications
- Large infrared focal plane arrays
- Military and space applications
- Large XY, UV detector
Key Features
LDP150
- Self leveling sphere moving on air bearing and locked by vacuum preserves the initial parallelism of the component stack
- High force (up to 100,000N) and controlled force profile ensure bond join quality
- Granite base and rigid stiff steel structure maintain the initial high accuracy of the assembly
– XY : ± 1 µm
– Parallelism : ± 1 µm
– Independent of component size
Technical Specifications
Contact us for more information
SET, Smart Equipment Technology, is a world leading supplier of High Accuracy Flip Chip Bonders and versatile Nanoimprint Lithography (NIL)…
