SET – FC300
The FC300 is a high accuracy and high force flip-chip bonder for Chip-to-Chip (up to 100 mm) and Chip-to-Wafer (up to 300 mm) applications. FC300 covers a large range of bonding forces, from 1 to 4000N. That makes it perfectly suitable for reflow and thermocompression processes.
The leveling between both components is adjusted before each bonding within 1 µradian. The parallelism adjustment, the high resolution alignment and the perfect control of all bonding parameters allow to achieve submicronic post-bond accuracy.
Key Features
- Accuracy ± 0.5 µm
- Low/High of bonding forces
- Perfect parallelism control
- Confining gas including formic acid
- Unique vision system
- Form R&D to pilot line
Technical Specifications
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Applications
- Infrared and X-Ray image sensors
- 3D-intergration
- Memory stacking
- Optoelectronics and Silicon Photonics
- Flip Chip bonding
- Mass Transfer of mini and micro LED
- Quantum Computing
- Die bonding
- Chip to Chip
- Chip to Wafer
- Nanoimprinting
Key Industries
- Infrared and X-Ray image sensors
- Semiconductors
- Memory
- Optoelectronics and Silicon Photonics
- Micro LEDs displays
- Quantum Computing
SET, Smart Equipment Technology, is a world leading supplier of High Accuracy Flip Chip Bonders and versatile Nanoimprint Lithography (NIL)…
