SET – ACCµRA Plus
ACCµRA Plus is a flip-chip bonder designed for ± 0.5 µm accuracy in full automatic mode. It is suitable for reflow and thermocompression processes.
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ACCµRA Plus combines high precision, flexibility and short cycle time. It is dedicated to production for Optoelectronic and Silicon photonics applications.
Key Features
- Accuracy ± 0.5 µm
- High accuracy and high throughput
- Throughput 120 UPH
- Full automatic
- High flexibility and reliability
- Ultra-small dies
Technical Specifications
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SET – ACCµRA Plus
Applications
- Laser diode, laser bar
- VCSEL, photo diode
- LED
- Prisms, lenses, mirrors
- Micro Assembly
- Flip-chip bonding, die bonding
- Chip-to-chip, chip-to-substrate bonding
Industries
- Optoelectronics and Silicon Photonics
SET, Smart Equipment Technology, is a world leading supplier of High Accuracy Flip Chip Bonders and versatile Nanoimprint Lithography (NIL)…
