Kardex In Association with Intertex.

The TowerMat and InterMat heavy-duty units are ideal solutions for companies that want to store oversized and extremely heavy goods in an efficient, safe, and compact manner.

The Kardex Compact Buffer is a Vertical Buffer Module (VBM) that provides an efficient solution for fast-growing product ranges with limited storage space.

This scalable bin solution works as a mini-load system and flexibly stores, picks and buffers small parts. With the recently launched version, capable of extending up to 20 meters, the Kardex Compact Buffer provides valuable benefits. It allows companies to maximize space by utilizing the storage area at a minimal cost.

The Kardex Miniload-in-a-Box* is part of the product family Vertical Buffer Module (VBM) and provides solutions for fast-growing product ranges with limited storage space. The system uses a lightweight mini-load crane with a telescopic gripper to individually transport bins or trays to the access opening point.

Next-generation and time-tested capabilities are combined in this upgraded system to increase productivity by up to 50% over the top-selling Spectrum^® ll, all in a space-saving footprint.

SPHERE series systems support automated handling and processing of round or square wafer/substrate sizes ranging from 75mm to 300mm. In addition, thin wafer processing with or without carriers is possible, depending upon wafer thickness.

The patented plasma chamber design provides exceptional etch uniformity and process repeatability. Primary plasma applications include a variety of etching, ashing, and descum steps. Other plasma processes include contamination removal, surface roughening, increasing wettability, and enhancing bonding and adhesion strength, photoresist/polymer stripping, dielectric etch, wafer bumping, organic contamination removal, and wafer destress.

• Wafer Cleaning – The SPHERE series plasma systems remove contamination prior to wafer bumping, remove organic contamination, remove fluorine and other halogen contamination, and remove metal and metal oxides. Plasma also improves spun-on film adhesion and cleans metallic bond pads.
• Wafer Etching – Plasma systems descum wafer of residual photoresist and BCB, pattern dielectric layers for redistribution, strip/etch photoresist, enhance adhesion of wafer applied materials, remove excess wafer applied mold /epoxy, enhance adhesion of gold solder bumps, destress wafer to reduce breakage, improve spun-on film adhesion, and clean aluminum bond pads.

Bare Board Loader With Pass Through Mode is used for loading of bare PCBs to the production line.

Faulty boards can be lifted up for visual inspection without interrupting the PCBs flow.

This unit is used when a passage way is required in a production line (fully automatic).