VJ Electronix – Summit Lxi
The go-to rework system for 5G, and large board applications. The Summit LXi is capable of handling boards up to 25″x47” and components as small as 01005. Built with easy-to-use 1-2-3-GO software, operation of this rework system is simple and intuitive. Efficient convection heating provides high thermal throughput, uniformity, and a repeatable rework process. Proprietary software provides product traceability, profile analysis, and sharing of profiles between VJE systems.
Technical Specification
Placement | 0.0010″ (25µ) mean + 30 |
Top Heater | 2.2kW |
Bottom Heater | 8.0kW Convection Plenum | 10.0kW Convection Plenum (option) |
Field of View | (80mm) Square / 90 mm option |
Max. Board Size | 24×36″ (600×900mm) | 26×48″ (650×1200mm) (optional) |
Min. Component Size | 0.0010″ (25µ) mean + 30 |
Compliance | CE |
For further details, please refer to enclosed brochure. |
Key Features
- Easy-To-Use Auto Profiling Software
- Simple Component-to-Site Alignment
- Repeatable Thermal Performance
- Automatic Non-Contact Site Scavenging
- MES Interface
- Available Tooling for Any Surface Mount Component
Key Industries
- Semiconductor, Solar & Electronics