Scia Systems – Magnetron Sputtering Systems – scia Magna 200 and scia Multi 680
The scia Magna 200 uses a unique Double Ring Magnetron architecture to achieve very high homogeneity of coatings at impressively high deposition rates. Typical applications include piezoelectric layers, optical coatings and passivation layers.
The scia Multi 680 is designed for periodic multilayer coatings for substrates up to 650 mm dia. and 50 kg. Typical applications are gradient multilayer coatings of mirrors for soft X‑ray and anti-reflective coatings in UV and X‑ray applications.
Available in :
There is a single magnetron configuration (Magna 200) which deposits one target material across the entire surface of the wafer. The target can be a single element or compound, or have a metal target combined with reactive gasses such as oxygen or nitrogen to deposit dielectrics.
The co-sputtering configuration (Magna 200) contains up to 4 smaller magnetron targets. Different target materials can be combined to sputter alloys, or same target materials can be combined for bipolar sputtering. There is also reactive sputtering capabilities in this configuration.
The dynamic deposition configurations (Multi 680) the substrate moves in a linear or orbital path across rectangular magnetron targets for precise multilayer coatings. This configuration is mainly used for depositing on large substrates, up to 1.5m.
In all magnetron sputtering tools, the substrate is capable of rotating to improve uniformity.
Key Features
Magna 200
- RF bias for conformity and stress control
- Superior uniformity with rotatable substrate holder
- Low substrate temperature with helium cooling contact and electrostatic chuck
- High deposition rates with reactive sputtering in unipolar and bipolar mode
- Variation of film properties by adjustable energetic substrate bombardment
- Co-sputtering with confocal arrangement of magnetrons
Multi 680
- Homogeneous or gradient films on curved substrates by synchronized orbital and spin rotation
- Up to 7 magnetrons, each with separate housing for individual gas supply and defined particle emission profile
- Optional pretreatment with additional ion beam source
- Carrier based handling system with load lock and two independent substrate positions
- Substrate face-down orientation for minimized particle load
Available Models
Technical Specifications
| Substrate Diameter | Up to 650 mm; weight up to 50 kg |
| Sputter Source | Up to 6 rectangular 24” sputter magnetrons |
|---|---|
| Sputter Modes | DC, RF, DC pulsed |
| Typical Deposition rates | Cr: 45 nm/min; Si: 22 nm/min; Ti: 22 nm/min |
| Uniformity Variation | < 0.1 % over 300 mm diameter; < 0.5 % over 450 mm diameter |
| Base Pressure | < 1 x 10-8 mbar |
| System Dimensions (W x D x H) | 7.90 m x 4.40 m x 3.50 m (without electrical rack and pumps) |
| Tool Configuration | 1 load-lock with 1 coating chamber |
| Software Interface | SECS II / GEM |
The scia Multi 680 is designed for periodic multilayer coatings for substrates up to 650 mm dia. and 50 kg. Typical applications are gradient multilayer coatings of mirrors for soft X‑ray and anti-reflective coatings in UV and X‑ray applications.
The scia Multi 680 uses 6 radially arranged sputter magnetrons, each mounted in a separate housing for individual gas supply and a defined particle emission profile. The substrate is moved across the magnetrons in a circular path in face‑down orientation by a two-phase coupled rotary drive. Each orbital rotation completes one period of the multilayer stack. Precalculating the profiles of the orbital rotation enables compensation of the individual emission profiles of the magnetrons and deposition of required gradient films along the spin rotation axis.
Technical Specifications
| Substrate Diameter | Up to 200 mm |
| Substrate Holder | Water cooled, up to 20 rpm rotation, helium backside cooling contact, RF bias |
|---|---|
| Sputter Source | Double Ring Magnetron DRM 400 from Fraunhofer FEP |
| Sputter Modes | DC, RF, uni- and bipolar pulse mode |
| Typical Deposition rates | SiO2: 5 nm/s, Al2O3: 3 nm/s, Metals: 15 … 25 nm/s |
| Uniformity Variation | ≤ 0.5 % |
| Base Pressure | < 1 x 10-6 mbar |
| System Dimensions (W x D x H) | 1.20 m x 2.00 m x 2.20 m (without electrical rack and pumps) |
| Tool Configurations | Single wafer load-lock, cassette handling, cluster system |
| Software Interfaces | SECS II / GEM, OPC |
The scia Magna 200 uses a unique Double Ring Magnetron architecture to achieve very high homogeneity of coatings at impressively high deposition rates. Typical applications include piezoelectric layers, optical coatings and passivation layers.
The system is available with either a single wafer load-lock or an automatic handling robot in a cluster configuration. Its advanced substrate holder features simultaneous rotation, helium cooling and RF bias.
The special DRM 400 sputter source from Fraunhofer FEP has individually controllable plasma discharges from the concentric inner and outer target rings, enabling layer thickness variation of less than ± 0.5 % (over 200 mm). At the same time, very high deposition rates in reactive sputter mode can be achieved. Due to its integrated control mechanisms, long term stability of processing is ensured.
Manufacturer of advanced ion beam and plasma processing systems, scia Systems established itself in a very short time on the…
