Scia Systems – PEVCD/RIE Systems – scia Batch 350
The scia Batch 350 is designed for homogeneous coating of several 3‑dimensional shaped substrates in one batch. Typical applications are biocompatible films for medical objects. Â
The scia Batch 350 uses a RF parallel plate arrangement with rotation of each substrate for a homogeneous coating of all sides. The system is also available with an additional DC bias applied to the substrate holder.
Technical Specifications
| Carrier Size | 2 carriers with maximum size of 350 mm x 240 mm |
|---|---|
| Substrate Holder | Water cooled, pulsed DC bias |
| Plasma Source | RF parallel plate arrangement, 13.56 MHz |
| Max. RF Power | 2 x 600 W |
| Electrode Setup | Temperature: Heating up to 400°C |
| Distance: Adjustable between 50 mm and 150 mm | |
| Operation Modes | Independent or coupled electrodes |
| Typical Deposition Rate | SiC: 5 nm/min |
| Base Pressure | < 5 x 10-7 mbar |
| System Dimensions (W x D x H) | 0.90 m x 1.70 m x 2.30 m (without electrical rack and pumps) |
| Tool Configuration | 1 process chamber with manual loading |
| Software Interface | SECS II / GEM |
Key Industries
- Semiconductor, Solar & Electronics
Brand
Manufacturer of advanced ion beam and plasma processing systems, scia Systems established itself in a very short time on the worldwide market. Products are dedicated to the industry of Microelectronics, MEMS and precision optical manufacturing : etching, trimming, sputtering systems.
