InnoLas Solutions – Split Axis Machine – EXPEGO
Versatile Laser System for Micro Material Processing
EXPEGO is a laser processing workstation designed for high-precision applications in the electronic, precision engineering, and photovoltaic industries. It is mainly used for microvia drilling, cutting (routing), structuring and cavity formation in PCBs with typical dimensions as 610 x 460 mm and 635 x 540 mm.
Technical Specifications
| Applications | Micro Via Drilling, Routing, Depaneling, Micro Structuring, Selective Ablation, Cavity Formation |
| Accuracy | < +/-10 μm abs. < +/-2 μm repeatability |
|---|---|
| Substrates | Dimension up to 29.5” x 25” (750 mm x 635 mm) Rigid-, flex-PCBs, ceramic, glass and advanced materials |
| Available laser sources | Wavelength: 9.4, 10.6 μm (CO2), 1064, 1030, 532, 515, 355 nm Pulse: μs, ns, ps, fs |
| Dimensions | 1750 x 2200 x 2600 mm |
Key Features
ILS-ST
- Ultra fast laser technology
- Single or dual process head setup
- In-situ scanner calibration
- Double table option
- Processing one or more substrates in parallel
- Automatic laser to camera offset calibration
- Automated process controls
- Automated vision system for precision alignment and scaling, offset, trapezoidal and rotation compensation
- Stand alone or production line integrated system
Key Industries
- Semiconductor, Solar & Electronics
InnoLas Solutions was founded in October 2013 as a demerger of InnoLas PV and electronic business and looks back on…
