HANMI – Bonder
Maximize degree of precision and durability with minimizes vibration by applying super iron casting.
Available in :
HANMI’s Super Iron Casting Bonders aim to enhance productivity and reliability in semiconductor assembly operations.
Key Features
- High productivity
- High accuracy
- Thin die/ small die handling capability
Available Models
Key Features
- High productivity
- Flexible functions
- Multi-chip capability and customizing capability
- Precise dispensing
- Epoxy vision inspection
Key Features
- High productivity
- High accuracy
- Flux vision inspection
- Thin die/ small die handling capability
- Multi-die bonding capability
Key Features
- High productivity
- High accuracy
- Thin die/ small die handling capability
- Smart machine ready
- 8 bonding pickers
Key Features
- Panel size 600mm x 600mm
- Multi-bonding heads
- High accuracy
- Face up and face down selective bonding
- Multi-die bonding capability
Key Features
- High productivity
- Hight accuracy
- Thin die/ small die handling capability
- Smart machine ready
Key Features
- High productivity
- Hight accuracy
- Multi-chip capability and customizing capability
- Dual wafer table
Key Features
- High productivity (shortest bonding time)
- Lower thermal stress
- Lower warpage risk
- Lower power consumption (vs mass reflow)
Founded in 1980 to support the development of Korea’s semiconductor industry, Hanmi Semiconductor has grown steadily into a world-class semiconductor…
