Configuration dependent, process capabilities include flux-less soldering, eutectic die attach, gold tin soldering, void-free soldering, hermetic lid sealing, formic acid processing and flip chip soldering etc.
Key Features
- Small Footprint, Freestanding Vacuum Reflow Oven
- Touch TCs with Quick Swap Hotplates
- Maximum Temperature 450°C, (optional 700°C)
- Temperature ramp-up rate 3.5K/sec
- Up to 100 process steps per profile recipe
- Automatic Chamber Opening / Closing
- Optional Top Heating
- Heated Area: 314 x 314 mm
- Oxygen < 1 ppm
- Optional High-Pressure Atmosphere: up to 3 bar (abs)
- Formic Acid, H2 or Solder Paste Activation
Technical Specification
| Footprint | 960 x 760 x 1800mm (LxWxH) |
| Weight | 240kg. (minimum configuration) |
| Chamber height | up-to 100mm |
| Heated area | 314 x 314mm |
| Chamber lid open/closing | automatic lid closing/opening and locking/unlocking, |
| Heating method | IR (12pcs. Lamp Array) |
| Heating Zone | 3 Zones |
| For further details, please refer to enclosed brochure. |
Key Industries
- Semiconductor, Solar & Electronics
Founded in 1982 ATV Technologie GmbH is an international player in the field of micro electronics focussing on manufacturing and…
