ATV – Diamond Scriber RV-129
This reliable Diamond Scriber performs fast, easy and precise scribing and cutting of silicon wafers, as well as thin and thick film ceramic and glass substraits. It forms the grooves necessary for effective glass or ceramic cutting: shallow, even and continuous.
All essential operating parameters – the angle of the scribing tool, the scribing force, the touchdown point and the lift up point of the tool are precisely adjustable to ensure optimal felxibility and repeatable results.
Key Features
- Fast and easy operation
- No maintenance
- Multipurpose diamond tool with 4 cutting edges
- Adjustable scribing force
- Adjustable substrate thickness
- Precise step and repeat by adjustable
- Mechanical stop with angular adjustmen
- Roller blade for glass (option)
Technical Specification
X axis movement range/maximum substrate width | >/= 240 mm, resolution 10 micro meter with digital gauge |
Y axis movement range/maximum scribing length | >/= 240 mm |
Maximum substrate thickness | >/= 10 mm |
Scribing pressure range | 5 – 581 grams by positioning of weights on a balance scale |
Digital Camera: Dimensions | 500 x 500 x 300 mm |
Digital Camera: Weight | approx. 25 kg |
Key Industries
- Semiconductor, Solar & Electronics
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