AIM – Solder Paste
AIM’s complete line of solder paste has been developed to deliver robust performance, ease of use and cost effectiveness. AIM solder pastes resolve difficult issues including QFN voiding, low area ratio printing, and high reliability requirements for consumer, LED, automotive, aerospace and military applications.
AIM solder paste is available in no clean, water soluble, and RMA formulations with a wide variety of alloy offerings including AIM’s proven REL alloys, SAC, SN100C® and lead-based solders. AIM’s alloy and flux combinations provide high quality performance for a wide variety of SMT applications. In addition to SAC based SMT paste, AIM offers low temperature solder paste and jetting solder paste.
Key Features
- Lead-Free and Tin/Lead Compatible
- Halogen- and Halide-Free
- Excellent Wetting
- No Head-in-Pillow
- Low Tombstoning
- Clear Pin-Probe Testable Residue
- Extended Stencil Life and Tack Tim
Available Models
AIM’s no clean solder paste combines performance and reliability without the expense of cleaning. Designed to provide stable transfer efficiencies, powerful wetting, and low voiding, AIM no clean solder pastes address current and future assembly challenges. AIM’s full line of no clean solder paste is available in a wide selection of alloys to meet your process requirements. AIM has partnered with industry cleaner and chemistry manufacturers to ensure residue can be removed when necessary.
Available Solder Paste Products
- H10 Halogen-Free No Clean Solder Paste
- M8 No Clean Solder Paste
- V9 Low-Voiding Solder Paste
- J8 No Clean Jetting Solder Paste
- NC273LT Low Temperature Solder Paste
- NC257MD Jet Printing Solder Paste
AIM’s water soluble solder paste products have been engineered for powerful wetting and exceptional print performance even in high humidity environments. AIM water soluble paste residues are easily removed with DI water alone up to 48 hours after reflow, even under low stand-off devices. AIM’s formulations provide a low foaming solder paste that can extend closed loop filtration service life. AIM’s water soluble product offerings exceed industry demands for a reliable, low voiding solder paste.
Key Features of W20 Water Soluble Solder Paste
- Zero Halide/Halogen per J-STD-004/B
- RoHS Compliant (lead-free alloys only)
- DI Water Wash
Key Features of WS488 Solder Paste
- Excellent Wetting
- Extended Cleaning Window
- Superior Slump Resistance
AIM’s RMA/RA solder pastes are designed for use where mil spec performance is required. AIM rosin based solder pastes provide modern paste print performance combined with traditional military compliance. Additionally, AIM’s RMA/RA solder pastes can withstand extended hot reflow profiles required for backplane and thermally massive assemblies. AIM’s rosin solder pastes provide superior performance on oxidized or uncleaned surfaces and long pause-to-print capabilities. AIM has partnered with aqueous, solvent and vapor degreaser cleaning manufacturers to ensure residues can be removed with all systems and leave no white residue.
Features of RMA258-15R Solder Paste
- Long Pause-to-Print Capabilities
- Enhances Fine Print Definitions
- No Head-in-Pillow
- Excellent Wetting, Even Leadless Devices
- Exceptional Reflow During Long, Hot Profiles
- Reduced Voiding
- Available in Industry Standard Sizes
AIM’s low temperature solder paste offers exceptional performance combined with peak reflow temperatures as low as 170°C. AIM’s NC273LT solder paste provides 8+ hour stencil life, stable transfer efficiency and excellent wetting, while eliminating solder balling that is common with bismuth bearing pastes.
Features of NC273LT Low Temperature Solder Paste
- Designed for Low Temperature Applications
- Improved Wetting for Bismuth Alloys
- Long Stencil Life
- Excellent Transfer Efficiencies
- Minimizes Solder Balling
- RoHS Compliant
Solder Paste Selection Guide
| Product | Flux Type | Available Powder Sizes* | Standard Alloys* | Dispensing Capability | Product Attributes | |
|---|---|---|---|---|---|---|
| M8 | No Clean | T4 – T6 | REL22™, REL61™, SAC Alloys, SN100C< Sn/Pb Alloys, Sn/Cu Alloys | Yes | • Low voiding • Fine pitch printing • Mitigates print defects (HiP) • Minimal, transparent, and easy to clean residues | |
| NC273LT | No Clean | T4 – T6 | Sn/Bi Alloys | Yes | • Used for low or reduced temperature applications • Improved wetting for use with bismuth alloys • 8+ hour stencil life | |
| J8 | No Clean | T6 | SAC Alloys, Sn/Pb Alloys | Jetting | • Low voiding • No Skips • Capable of 200μm deposits | |
| NC257MD | No Clean | T5 | SAC305, Sn63/Pb37 Alloys Only | Jetting | • For use in Mycronic Jet Printers • Prolongs ejector life • Reduces voiding | |
| W20 | Water Soluble | T4 | SAC305 | No | • Halogen/Halide Free • Residue easily cleaned in DI Water • 8+ hour stencil life • 2+ week extended cleaning window | |
| WS488 | Water Soluble | T4 – T6 | SAC Alloys, Sn/Pb Alloys | Yes | • Excellent wetting • Residue easily cleaned in DI water • Superior slump resistance • 8+ hour stencil life | |
| RMA258-15R | Rosin | T4 – T6 | SAC Alloys, Sn/Pb Alloys | Yes | • Long pause-to-print capabilities • Reduced voiding • For use during long, hot reflow profiles | |
| * Additional alloys and powder sizes may be available upon request | ||||||
Tutorials – Solder Paste Handling Guidelines
Key Industries
- Semiconductor, Solar & Electronics
AIM Solder is a leading global manufacturer of solder assembly materials for the electronics industry, catering to various specialized businesses…
