ADT – Dicing Peripheral
ADT dicing peripheral is a precision cutting tool used in semiconductor and electronics manufacturing for precise and efficient dicing of wafers and substrates into smaller chips. It features high accuracy, low kerf loss, and excellent edge quality for optimal yield and reliability.
ADT offers dicing peripheral equipment and accessories, such as auto wafer cleaner, water recycling system, spindle water chiller, semi-auto wafer mounter, and more.
Two main product groups:
- Water Treatment Systems: Complete set of solutions for water recirculation and process stabilization.
- Wafer Handling Systems: Complete set of wafer mounting, cleaning, and curing solutions.
Key Features
- Used for dicing wafers and substrates into smaller chips
- High accuracy and low kerf loss for optimal yield
- Compatible with a wide range of materials and thicknesses
- Robust and durable design for long-term use
- Offers advanced automated blade height adjustment and real-time monitoring.
Available Models
Key Industries
- Semiconductor, Solar & Electronics
More Products
Advanced Dicing Technologies (ADT) specializes in the development and manufacturing of systems, blades and processes used in the dicing of…