Achilles – Wafer Carriers
Achilles offers a full range of wafer carriers models depending on the wafer types, all using antistatic and high-purity material, and compatible with packing machines.
Available in :
FranceSingapore
- Protos Carrier MA series Improve the shipping efficiency, 25 wafers of capacity. Can be used with spacers or rings. For 4“, 5“, 6“, 8“ and 12“ wafers.
- Protos Carrier ND series Carrier for diced wafers, can contain between 13 and 25 wafers depending on the model. Compatible with 6“, 8“ and 12“ framed wafers.
Key Features
- Package of up to 25 wafers.
- Stable antistatic measures, low particle level, low ion contamination,
- excellent shock-absorbing characteristics.
- NA Series uses snap- tting.
- Our Compression tabs structure can hold wafers during transportation(NA-300LA)
Technical Specifications
- Protos Carrier MA series: Improve the shipping efficiency, 25 wafers of capacity. Can be used with spacers or rings. For 4“, 5“, 6“, 8“ and 12“ wafers.
| Part Number | MA-5 (5inch carrier) MA-6 (6inch carrier) MA-6S(6inch slim carrier) MA-8 (8inch carrier) MA-8S(8inch slim carrier) MA-12 (12inch carrier) |
| Feature | – Double-wall construction provides excellent impact resistance while wafers are firmly protected inside. – Can be used by automatic wafer loading equipment (robots). – A 3.5 inch floppy disk for data can be stored under the lid. (8 inches only) – The lid and body are supplied as a set, which opens and closes by turning the lid. – Partial filling acceptable. |
|---|---|
| Surface Resistance | <1.0×106Ω |
| Material | Conductive Polypropylene |
- Protos Carrier ND series: carrier for diced wafers, can contain between 13 and 25 wafers depending on the model. Compatible with 6“, 8“ and 12“ framed wafers.
| Part Number | ND-6 (correspond to dicing frame for 6 inch wafer) ND-8 (correspond to dicing frame for 8 inch wafer) |
| Feature | – Simplify the packing of diced wafer on frame to increase work efficiency. – Diced wafer on frame can be stacked up to 13 pieces. – With stopper for dicing frame (It varies by the kind of frame) – Cushioning material and spacer correspond to diced wafer on frame (6 inch and 8 inch) are available. Please ask for more information. |
|---|---|
| Surface Resistivity | < 1.0×106Ω |
| Material | Conductive Polypropylene |
Key Industries
- Semiconductor, Solar & Electronics
Achilles is manufacturing wafer handling systems with high purity materials for safe transportation of wafers.
