The Multi Function Cage-type Buffer offers multiple functions, making it adaptable to diverse manufacturing environments. It efficiently manages product flow, optimizes space utilization, and minimizes the risk of damage during transit. 

For customers with preference of traditional dishwasher style machine, CompaCLEAN provides the type of cleaning many are accustomed to while minimising the shadow effect thanks to unique linear tangent spray technology. PCBs are loaded just like plates into a typical kitchen dishwasher.

Key Features

• Small Footprint
• Single Basket or Double Basket
• Easy Loading
• Basket Oscillation
• Uniform Tangent Spray
• Shadow Mitigating System
• Adaptive Rinse
• Closed or Open Loop
• Low Running Cost

Ideal machine for customers looking for the best cleaning results without the need for automation or very high throughput. Best solution for medium to low quantity of complex products that need to be cleaned perfectly. Application: High Density SMD Assemblies Capacity: Low to Medium Volume Contamination Solubility: Easy to Hard Handling Handling with the parts to clean is simple and safe. SuperSWASH III Reloading Stand

PCBAs are reloaded on the dedicated reloading stand. Operators reloads frames directly into machine chamber. This minimizes downtime to zero and provides comfortable time for reload.

Key Features

• Ultimate cleaning performance
• Easy operation
• Zero drain concept
• Linear direct spray for equal washing
• Hot air knife direct dry
• Illuminated glass door chamber for visual process control
• Quick changover to Twingo – double capacity configuration
• Wide range of standard and customized PCBA fixtures

The AOP platform is the most flexible and modular Solarius solution for all kinds of customized measurement tasks. Depending on the indivisual task, it can be equipped with different 3D measuring sensors out the entire available technology portfolio, many sizes of motion systems and customized software. Its flexibility supports a wide variety of applications and working environments and can be tailored to meet each customer’s requirements.

The Viking is an optical non-contact profilometer for affordable 3D surface and roughness measurements. Its small footprint and light weight design makes it ideal as a desktop 3D measurement tool. It is designed to meet mid-range accuracy and quality control needs using state-of-the-art sensor technology to generate 3D surface topography maps and ISO compliant roughness information.

The inspection system X7056-II BO effectively combines optical in-line wire bond control with automatic X-ray inspections. This comprehensive inspection concept enables higher efficiency, optimizes cycle times and thus improves throughput. Where the bottom line is concerned, procurement costs are significantly lower than purchasing two separate inspection systems.

The iX7059 One can guarantee exceptional precision, with a resolution down to 1µm, ensuring every detail is captured with accuracy. This advanced system offers versatile 2D, 2.5D, and 3D X-ray inspection capabilities, making it perfect for semiconductor, power module, and leadframe applications.

Our rework system boasts user-friendly 1-2-3-GO software and efficient convection heating, along with proprietary software for product traceability and profile sharing between VJE systems. Automated features enable the reworking of large components, while non-contact site scavenging ensures the safe removal of residual solder. This system provides a reliable and efficient solution for rework processes.

Rework done on the Summit 2200i with Auto Align results in reliable, repeatable processes with greater system up-time, machine utilization, and a faster ROI.