The TSM N2 Reflow is a high-end reflow oven that provides precise temperature control for the most demanding soldering applications. It features a nitrogen atmosphere that minimizes oxidation and improves soldering quality, ensuring consistent and…
The TSM N2 Reflow is a high-end reflow oven that provides precise temperature control for the most demanding soldering applications. It features a nitrogen atmosphere that minimizes oxidation and improves soldering quality, ensuring consistent and reliable results. With a compact design and intuitive user interface, the TSM N2 Reflow is a must-have for any electronics manufacturing facility looking to achieve the highest levels of quality and efficiency.
Key Features
- Realize Flux Zero in OVEN -> equip FMS applied with patent technology
- Thermal Interference Innovation in each zone -> Able to set up temperature difference with 60ºC in max. of interzone
- Internal Heat Reduction of Reflow -> apply New Emission System
- Real-time Monitoring,temperature Profile Monitoring and Oxygen Concentration Monitoring in each zone
- Conveyor Vibration Monitoring