The iS6052 SPI is Viscom’s cutting-edge solution for precise solder paste inspection in SMD production. With over four decades of expertise behind it, this 3D inline system ensures comprehensive evaluation of key solder features such as volume, height, shape, and more. Advanced sensor technology, including an orthogonal camera and four lateral views, enhances inspection accuracy, while realistic color imaging accelerates verification. The Fast Flow handling system boosts throughput, synchronizing assembly flow seamlessly and minimizing handling times. Equipped with intelligent networking capabilities, the iS6052 SPI offers superior process stability and efficiency for modern SMT lines. 

The iX7059 One can guarantee exceptional precision, with a resolution down to 1µm, ensuring every detail is captured with accuracy. This advanced system offers versatile 2D, 2.5D, and 3D X-ray inspection capabilities, making it perfect for semiconductor, power module, and leadframe applications. Designed for 100% inline inspection, the iX7059 One excels in detection, providing reliable performance for high-volume production. With easy programming and seamless integration, it’s the ideal solution for manufacturers seeking consistent quality and efficiency.

The most installed rework system in the world. The Summit 1800i is capable of handling boards up to 22″x30” and components as small as 01005. Built with easy-to-use 1-2-3-GO software, operation of this rework system is simple and intuitive. Efficient convection heating provides high thermal throughput, uniformity, and a repeatable rework process. Proprietary software provides product traceability, profile analysis, and sharing of profiles between VJE systems.

XQuik III Highest count accuracy in the simplest, fastest x-ray component counter. XQuik III counts the most difficult reels at the 99.8% industry accuracy standard.