The LDP150 is an electrical Press especially designed for bonding large light or radiation detectors (50 ~ 150mm). It uses compression process at room temperature (thermo-compression option available).

A predefined gap can be achieved between two components previously pre-bonded using a high accuracy device bonder such as the SET FC150. The devices are pressed together at room temperature while preserving the initial high accuracy alignment and parallelism.

The LDP150 is able to apply pressure up to 100,000N.

Applications

• Large infrared focal plane arrays
• Military and space applications
• Large XY, UV detector

The reflow soldering systems from SMT Wertheim stand for maximum efficiency and high product throughput with stable soldering quality.

The new Polaris Desktop 3D surface measuring system from Solarius enables highly accurate and precise 3D imaging of surfaces. While the Polaris and the Polaris Plus are equal in accuracy and precision, the Polaris offers a cost effective variant for many applications. The Polaris Plus expands the scope of application due to its extensive equipment, which supports in particular simple automation of the measurement tasks.

Surfx provides turnkey and OEM plasma systems for surface treatment of just about any part, regardless of size, shape, or production quantity.  We proudly supply the most trusted atmospheric plasma machines to industries all over the world. 

The TRV series offers the outstanding productivity and safety operation of equipment. Particularly , the Compact Vacuum Chamber and Conveyor are technically proved solutions in the field through a technical partnership with ETC.

The iS6052 SPI is Viscom’s cutting-edge solution for precise solder paste inspection in SMD production. With over four decades of expertise behind it, this 3D inline system ensures comprehensive evaluation of key solder features such as volume, height, shape, and more. Advanced sensor technology, including an orthogonal camera and four lateral views, enhances inspection accuracy, while realistic color imaging accelerates verification. The Fast Flow handling system boosts throughput, synchronizing assembly flow seamlessly and minimizing handling times. Equipped with intelligent networking capabilities, the iS6052 SPI offers superior process stability and efficiency for modern SMT lines. 

The most installed rework system in the world. The Summit 1800i is capable of handling boards up to 22″x30” and components as small as 01005. Built with easy-to-use 1-2-3-GO software, operation of this rework system is simple and intuitive. Efficient convection heating provides high thermal throughput, uniformity, and a repeatable rework process. Proprietary software provides product traceability, profile analysis, and sharing of profiles between VJE systems.