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Scia Systems – PEVCD/RIE Systems – scia Cube 300/750
The scia Cube 300/750 are designed for large area high density plasma processes of substrates up to 300 mm x 200 mm (scia Coat 300) and up to 750 mm x 750 mm (scia Coat 750). Typical applications are deposition of Diamond Like Carbon (DLC) for o…

The scia Cube 300/750 are designed for large area high density plasma processes of substrates up to 300 mm x 200 mm (scia Coat 300) and up to 750 mm x 750 mm (scia Coat 750). Typical applications are deposition of Diamond Like Carbon (DLC) for optical filters and dielectric films for anti-reflective coatings as well as etching processes with oxygen or halogen chemistry for the structuring of Semiconductors and metals.

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SEO – Phoenix (Portable)
The Phoenix series is designed to offer the flexibility required for QA. R&D and engineering process development. The Phoenix is a quite simple and virtually any measure size without sample cutting sample cutting preparation…

The Phoenix series is designed to offer the flexibility required for QA. R&D and engineering process development. The Phoenix is a quite simple and virtually any measure size without sample cutting sample cutting preparation. Light-weight means simple control device and simple handling. Phoenix adopted USB type camera. Easily connect to laptop and desktop computer with Surfaceware software.

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SEO – Phoenix MT
Phoenix MT is the world’s first model that can be used by turning the equipment, the individual modules can be separated, and the length of each main frame can be selected to change the model to suit almost all samples.

Phoenix MT is the world’s first model that can be used by turning the equipment, the individual modules can be separated, and the length of each main frame can be selected to change the model to suit almost all samples.

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SET – ACCµRA M
The ACCµRA M is a manual flip-chip bonder that allows ± 3 µm accuracy. This equipment permits to align manually the components with a high level of precision. The motorized arm controls precisely the bonding force. Combining and synchronizing t…

The ACCµRA M is a manual flip-chip bonder that allows ± 3 µm accuracy. This equipment permits to align manually the components with a high level of precision. The motorized arm controls precisely the bonding force. Combining and synchronizing the arm with the temperature controller, it guarantees a perfect quality and high repeatability of your process.

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SET – ACCµRA OPTO
The ACCµRA OPTO is a flip-chip bonder that allows ± 0.5 µm accuracy. It is dedicated to low force and reflow processes.

The ACCµRA OPTO is a flip-chip bonder that allows ± 0.5 µm accuracy. It is dedicated to low force and reflow processes.

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SET – ACCµRA Plus
ACCµRA Plus is a flip-chip bonder designed for ± 0.5 µm accuracy in full automatic mode. It is suitable for reflow and thermocompression processes.

ACCµRA Plus is a flip-chip bonder designed for ± 0.5 µm accuracy in full automatic mode. It is suitable for reflow and thermocompression processes.

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SET – ACCµRA100
The ACCµRA100 is a flip-chip bonder that allows ± 0.5 µm accuracy. Motorized axes guarantee a high repeatability of your process. Its flexibility makes it ideal for developing a wide range of applications. ACCµRA100 combines…

The ACCµRA100 is a flip-chip bonder that allows ± 0.5 µm accuracy. Motorized axes guarantee a high repeatability of your process. Its flexibility makes it ideal for developing a wide range of applications. ACCµRA100 combines high precision, accessibility and cost-effectiveness.

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SET – FC150
The FC150 is an accurate and very flexible flip-chip bonder for Chip-to-Chip (up to 100 mm) and Chip-to-Wafer (up to 200 mm) applications on the same open platform.

The FC150 is an accurate and very flexible flip-chip bonder for Chip-to-Chip (up to 100 mm) and Chip-to-Wafer (up to 200 mm) applications on the same open platform.

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SET – FC300
The FC300 is a high accuracy and high force flip-chip bonder for Chip-to-Chip (up to 100 mm) and Chip-to-Wafer (up to 300 mm) applications. FC300 covers a large range of bonding forces, from 1 to 4000N. That makes it perfectly suitable for reflow …

The FC300 is a high accuracy and high force flip-chip bonder for Chip-to-Chip (up to 100 mm) and Chip-to-Wafer (up to 300 mm) applications. FC300 covers a large range of bonding forces, from 1 to 4000N. That makes it perfectly suitable for reflow and thermocompression processes.

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SET – LDP150
The LDP150 is an electrical Press especially designed for bonding large light or radiation detectors (50 ~ 150mm). It uses compression process at room temperature (thermo-compression option available).

The LDP150 is an electrical Press especially designed for bonding large light or radiation detectors (50 ~ 150mm). It uses compression process at room temperature (thermo-compression option available).

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SET – NEO HB
NEO HB is a flip-chip bonder designed for ± 1 µm @ 3σ accuracy in stand-alone or full automatic mode (EFEM). It is suitable for Hybrid/Direct bonding processes. NEO HB combines high precision, flexibility and short cycle time.

NEO HB is a flip-chip bonder designed for ± 1 µm @ 3σ accuracy in stand-alone or full automatic mode (EFEM). It is suitable for Hybrid/Direct bonding processes. NEO HB combines high precision, flexibility and short cycle time.

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SET – NPS300
Optimized for the production of nanostructures, the Nano imPrinting stepper Stepper NPS300 is the first ever tool able to combine Hot Embossing and UV-NIL on a same platform. The NPS300 is able to print sub-20 nm geometries with …

Optimized for the production of nanostructures, the Nano imPrinting stepper Stepper NPS300 is the first ever tool able to combine Hot Embossing and UV-NIL on a same platform. The NPS300 is able to print sub-20 nm geometries with an overlay accuracy of 250 nm, when in-situ alignment is performed.

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SMT – Full Convection Reflow Soldering Systems
The reflow soldering systems from SMT Wertheim stand for maximum efficiency and high product throughput with stable soldering quality.

The reflow soldering systems from SMT Wertheim stand for maximum efficiency and high product throughput with stable soldering quality.

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Solarius – AOP
The AOP platform is the most flexible and modular Solarius solution for all kinds of customized measurement tasks. Depending on the indivisual task, it can be equipped with different 3D measuring sensors out the entire available…

The AOP platform is the most flexible and modular Solarius solution for all kinds of customized measurement tasks. Depending on the indivisual task, it can be equipped with different 3D measuring sensors out the entire available technology portfolio, many sizes of motion systems and customized software. Its flexibility supports a wide variety of applications and working environments and can be tailored to meet each customer’s requirements.

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Solarius – Atlas

The new Polaris Desktop 3D surface measuring system from Solarius enables highly accurate and precise 3D imaging of surfaces. While th…

The new Polaris Desktop 3D surface measuring system from Solarius enables highly accurate and precise 3D imaging of surfaces. While the Polaris and the Polaris Plus are equal in accuracy and precision, the Polaris offers a cost effective variant for many applications. The Polaris Plus expands the scope of application due to its extensive equipment, which supports in particular simple automation of the measurement tasks.

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Solarius – Polaris
The new Polaris Desktop 3D surface measuring system from Solarius enables highly accurate and precise 3D imaging of surfaces. While the Polaris and the Polaris Plus are equal in accuracy and precision, the Polaris offers a cost …

The new Polaris Desktop 3D surface measuring system from Solarius enables highly accurate and precise 3D imaging of surfaces. While the Polaris and the Polaris Plus are equal in accuracy and precision, the Polaris offers a cost effective variant for many applications. The Polaris Plus expands the scope of application due to its extensive equipment, which supports in particular simple automation of the measurement tasks.

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Solarius – Viking
The Viking is an optical non-contact profilometer for affordable 3D surface and roughness measurements. Its small footprint and light weight design makes it ideal as a desktop 3D measurement tool. It is designed to meet mid-rang…

The Viking is an optical non-contact profilometer for affordable 3D surface and roughness measurements. Its small footprint and light weight design makes it ideal as a desktop 3D measurement tool. It is designed to meet mid-range accuracy and quality control needs using state-of-the-art sensor technology to generate 3D surface topography maps and ISO compliant roughness information.

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Surfx – Argon Plasma Systems
The Atomflo^TM600 argon plasma system is ideally suited for in-line cleaning and activation of materials prior to bonding. The plasma produces a beam of reactive atoms that etch away contaminants on the surface all the way down to the…

The Atomflo^TM600 argon plasma system is ideally suited for in-line cleaning and activation of materials prior to bonding. The plasma produces a beam of reactive atoms that etch away contaminants on the surface all the way down to the atomic scale. .

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Surfx – Automation and Integration
Surfx provides turnkey and OEM plasma systems for surface treatment of just about any part, regardless of size, shape, or production quantity. We proudly supply the most trusted atmospheric plasma machines to industries all ov…

Surfx provides turnkey and OEM plasma systems for surface treatment of just about any part, regardless of size, shape, or production quantity. We proudly supply the most trusted atmospheric plasma machines to industries all over the world.

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Viscom – Bond Inspection X7056-II BO
The inspection system X7056-II BO effectively combines optical in-line wire bond control with automatic X-ray inspections. This comprehensive inspection concept enables higher efficiency, optimizes cycle times and thus improves throughput. Where t…

The inspection system X7056-II BO effectively combines optical in-line wire bond control with automatic X-ray inspections. This comprehensive inspection concept enables higher efficiency, optimizes cycle times and thus improves throughput. Where the bottom line is concerned, procurement costs are significantly lower than purchasing two separate inspection systems.

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Viscom – Optical Inspection iS6052 THT
The iS6052 THT inspection system is the most efficient quality control inspection of Viscom. Engineered for precise component placement verification on THT (Through-Hole Technology) boards. Utilizing advanced AOI (Automated Optical Inspection) tec…

The iS6052 THT inspection system is the most efficient quality control inspection of Viscom. Engineered for precise component placement verification on THT (Through-Hole Technology) boards. Utilizing advanced AOI (Automated Optical Inspection) technology, it inspects from above the PCB, setting it apart from conventional systems that inspect from below.

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Viscom – Solder Paste Inspection – iS6052-SPI
The iS6052 SPI is Viscom’s cutting-edge solution for precise solder paste inspection in SMD production. With over four decades of expertise behind it, this 3D inline system ensures comprehensive evaluation of key solder features such as volume, …

The iS6052 SPI is Viscom’s cutting-edge solution for precise solder paste inspection in SMD production. With over four decades of expertise behind it, this 3D inline system ensures comprehensive evaluation of key solder features such as volume, height, shape, and more.

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Viscom – X-ray Inspection – iX7059-One
The iX7059 One can guarantee exceptional precision, with a resolution down to 1µm, ensuring every detail is captured with accuracy. This advanced system offers versatile 2D, 2.5D, and 3D X-ray inspection capabilities, making it perfect for semico…

The iX7059 One can guarantee exceptional precision, with a resolution down to 1µm, ensuring every detail is captured with accuracy. This advanced system offers versatile 2D, 2.5D, and 3D X-ray inspection capabilities, making it perfect for semiconductor, power module, and leadframe applications.

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VJ Electronix – Apogee 90
The APOGEE 90 was built to fulfill the need for an affordable and reliable inspection system with advanced features for defect detection, failure analysis, and NDT in production environments.

The APOGEE 90 was built to fulfill the need for an affordable and reliable inspection system with advanced features for defect detection, failure analysis, and NDT in production environments.

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