The inspection system X7056-II BO effectively combines optical in-line wire bond control with automatic X-ray inspections. This comprehensive inspection concept enables higher efficiency, optimizes cycle times and thus improves throughput. Where the bottom line is concerned, procurement costs are significantly lower than purchasing two separate inspection systems.

The iX7059 One can guarantee exceptional precision, with a resolution down to 1µm, ensuring every detail is captured with accuracy. This advanced system offers versatile 2D, 2.5D, and 3D X-ray inspection capabilities, making it perfect for semiconductor, power module, and leadframe applications.

Our rework system boasts user-friendly 1-2-3-GO software and efficient convection heating, along with proprietary software for product traceability and profile sharing between VJE systems. Automated features enable the reworking of large components, while non-contact site scavenging ensures the safe removal of residual solder. This system provides a reliable and efficient solution for rework processes.

Rework done on the Summit 2200i with Auto Align results in reliable, repeatable processes with greater system up-time, machine utilization, and a faster ROI.

The PIA | nova® is a modular, highly automated coating platform for depositing metallic contact coatings, transparent conductive oxides (TCO) and various absorber coatings such as for CIGS or CdTe technology. The modular concept allows the combination of high reliability and efficiency with the unique flexibility of configuring the coater according to the requirements of the customer.