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Scia Systems – PEVCD/RIE Systems – scia Batch 350
The scia Batch 350 is designed for homogeneous coating of several 3‑dimensional shaped substrates in one batch. Typical applications are biocompatible films for medical objects.

The scia Batch 350 uses a RF parallel p…

The scia Batch 350 is designed for homogeneous coating of several 3‑dimensional shaped substrates in one batch. Typical applications are biocompatible films for medical objects.

The scia Batch 350 uses a RF parallel plate arrangement with rotation of each substrate for a homogeneous coating of all sides. The system is also available with an additional DC bias applied to the substrate holder.

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Scia Systems – PEVCD/RIE Systems – scia Cube 300/750
The scia Cube 300/750 are designed for large area high density plasma processes of substrates up to 300 mm x 200 mm (scia Coat 300) and up to 750 mm x 750 mm (scia Coat 750). Typical applications are deposition of Diamond Like Carbon (DLC…

The scia Cube 300/750 are designed for large area high density plasma processes of substrates up to 300 mm x 200 mm (scia Coat 300) and up to 750 mm x 750 mm (scia Coat 750). Typical applications are deposition of Diamond Like Carbon (DLC) for optical filters and dielectric films for anti-reflective coatings as well as etching processes with oxygen or halogen chemistry for the structuring of Semiconductors and metals.

The scia Cube 300/750 combine plasma excitation by an array of microwave sources. The substrate stage is equipped with an independent a RF bias. Various substrate sizes can be transferred with an automatic vacuum load-lock system.

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SCION – GC
The perfect GC for many applications that saves space without compromise on functionality and performance. Capacity for 2 injectors , 1 GC detector plus a mass spectrometer makes the SCION 436 a perfect match for your analyses.

The perfect GC for many applications that saves space without compromise on functionality and performance. Capacity for 2 injectors , 1 GC detector plus a mass spectrometer makes the SCION 436 a perfect match for your analyses.

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Scion – GC Analyzer
SCION has more than 50 standard, pre-configured systems available to meet a wide variety of applications, for example DHA, SIMDIST, RGA, BTU as examples. If you have an analytical challenge to solve then our long experience in designing, configuri…

SCION has more than 50 standard, pre-configured systems available to meet a wide variety of applications, for example DHA, SIMDIST, RGA, BTU as examples. If you have an analytical challenge to solve then our long experience in designing, configuring and manufacturing complete systems, with all their analytical benefits, ensures you get the solution that’s right for you.

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Scion – High Performance Liquid Chromatograph – LC 6000
The Scion 6000 Series HPLC aims for confidence in results through outstanding life-time performance. A robust design maximises uptime and productivity levels whilst minimises cost of operation. The SCION 6000 Series offers an array of automation o…

The Scion 6000 Series HPLC aims for confidence in results through outstanding life-time performance. A robust design maximises uptime and productivity levels whilst minimises cost of operation. The SCION 6000 Series offers an array of automation options for workflow optimisation, making our lab experience the best and easiest possible.

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SCION SQ GC- Quadrupole Mass Spectrometer
SCION SQ series GC-MS systems combine innovative engineering with detailed cutomer requirements to produce the truly advanced SCION SQ series. By designing these GC-MS systems to exceed the most critical performance and reliability requirements, S…

SCION SQ series GC-MS systems combine innovative engineering with detailed cutomer requirements to produce the truly advanced SCION SQ series. By designing these GC-MS systems to exceed the most critical performance and reliability requirements, Scion Instruments delivers systems that are especially for, and all about, the ultimate success of users.

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SeiLaser – Paperone
PaperOne Line is the innovative range of SEI Laser systems, with an automatic paper transportation, developed for the Folding Carton and Graphics Arts industry. It allows you to easily create any graphic project without the use of mechanical die-c…

PaperOne Line is the innovative range of SEI Laser systems, with an automatic paper transportation, developed for the Folding Carton and Graphics Arts industry. It allows you to easily create any graphic project without the use of mechanical die-cutting systems. Decoration, microperforation, die-cutting and micro die-cutting are some of the processes that can be made by exploiting PaperOne Line.

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SEO – Phoenix (Portable)
The Phoenix series is designed to offer the flexibility required for QA. R&D and engineering process development. The Phoenix is a quite simple and virtually any measure size without sample cutting sample cutting preparatio…
The Phoenix series is designed to offer the flexibility required for QA. R&D and engineering process development. The Phoenix is a quite simple and virtually any measure size without sample cutting sample cutting preparation. Light-weight means simple control device and simple handling. Phoenix adopted USB type camera. Easily connect to laptop and desktop computer with Surfaceware software.

Key Features
- Software working on Windows 7/8/10 32bit
- Preview function for rapidly capture image
- Contact angle measurement range: 3- 180°
- No required cutting sample
- Data export to Microsoft Excel
- Available to connect to notebook or desktop PC via USB port
- Analysis of plasma treatment to increase the wettability of polymers surfaces
- Adsorption / Wettability of powder and pharmaceutical products
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SEO – Phoenix MT
Phoenix MT is the world’s first model that can be used by turning the equipment, the individual modules can be separated, and the length of each main frame can be selected to change the model to suit almost all samples.
Phoenix MT is the world’s first model that can be used by turning the equipment, the individual modules can be separated, and the length of each main frame can be selected to change the model to suit almost all samples.

Key Features

Total flexibility: Easy to upgrade ( Manual → Auto One Drop → Multi syringes ) by modular design main frame

Automation : Automatic measurement progress at once

User friendly : Easy to transform for changed sample types

Tool Free changeover: Additional tools are not required for modular change

Changeable module position : According to sample nature, module can be change to cater for diverse sample nature/ form factor

Data output : Data can be exported as Excel file, offering the highest flexibility for further data processing
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Serstech – Raman Spectrometer – Arx
Serstech Arx is a revolutionizing instrument, introducing SharpEye^TM – a patented autofocus technology which improves the signal quality dramatically. Serstech Arx identifies unknown substances quickly and precisel…

Serstech Arx is a revolutionizing instrument, introducing SharpEye^TM – a patented autofocus technology which improves the signal quality dramatically. Serstech Arx identifies unknown substances quickly and precisely.

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SET – ACCµRA M

The ACCµRA M is a manual flip-chip bonder that allows ± 3 µm accuracy. This equipment permits to align manually the components with a high level of precision. The motorized arm controls precisely the bonding force. Combining and synchronizing the arm with the temperature controller, it guarantees a perfect quality and high repeatability of your process. The ACCµRA M, more than a pick-and-place system, offers thermocompression and reflow capabilities. It is the perfect equipment for universities and R&D institutes.

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SET – ACCµRA OPTO
The ACCµRA OPTO is a flip-chip bonder that allows ± 0.5 µm accuracy. It is dedicated to low force and reflow processes. The ACCµRA OPTO combines high precision, ﬂexibility and accessibility. It is the perfect equipment for optoelectronics an…

The ACCµRA OPTO is a flip-chip bonder that allows ± 0.5 µm accuracy. It is dedicated to low force and reflow processes. The ACCµRA OPTO combines high precision, ﬂexibility and accessibility. It is the perfect equipment for optoelectronics and silicon photonics applications.

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SET – ACCµRA Plus
ACCµRA Plus is a flip-chip bonder designed for ± 0.5 µm accuracy in full automatic mode. It is suitable for reflow and thermocompression processes.

ACCµRA Plus combines high pr…
ACCµRA Plus is a flip-chip bonder designed for ± 0.5 µm accuracy in full automatic mode. It is suitable for reflow and thermocompression processes.

ACCµRA Plus combines high precision, flexibility and short cycle time. It is dedicated to production for Optoelectronic and Silicon photonics applications.
Applications

Laser diode, laser bar

VCSEL, photo diode

LED

Prisms, lenses, mirrors

Micro Assembly

Flip-chip bonding, die bonding

Chip-to-chip, chip-to-substrate bonding
Industries

Optoelectronics and Silicon Photonics
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SET – ACCµRA100
The ACCµRA100 is a flip-chip bonder that allows ± 0.5 µm accuracy. Motorized axes guarantee a high repeatability of your process. Its flexibility makes it ideal for developing a wide range of applications. ACCµRA100 combines…
The ACCµRA100 is a flip-chip bonder that allows ± 0.5 µm accuracy. Motorized axes guarantee a high repeatability of your process. Its flexibility makes it ideal for developing a wide range of applications. ACCµRA100 combines high precision, accessibility and cost-effectiveness. It is the perfect equipment for universities and R&D institutes.

Applications
- Micro assembly
- Laser diode, laser bar
- VCSEL, photo diode
- LED
- Flip-chip bonding, die bonding
- Chip-to-chip, chip-to-substrate bonding
- MOEMS, MEMS, MCM packaging…
- 3D packaging
- Nanoimprinting (UV NIL and Hot Embossing)
Industries
- Semiconductors
- Memory
- Optoelectronics and Silicon Photonics
- Micro LEDs Displays
- Quantum Computing
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SET – FC150

The FC150 is an accurate and very flexible flip-chip bonder for Chip-to-Chip (up to 100 mm) and Chip-to-Wafer (up to 200 mm) applications on the same open platform.

The versatile design and the possibility to combine different processes make the FC150 ideal for developing a wide range of assembly applications including focal plane arrays and optoelectronic devices.

Perfect for advanced R&D, the FC150 is also appreciated for pilot production thanks to its full automatization.

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SET – FC300

The FC300 is a high accuracy and high force flip-chip bonder for Chip-to-Chip (up to 100 mm) and Chip-to-Wafer (up to 300 mm) applications. FC300 covers a large range of bonding forces, from 1 to 4000N. That makes it perfectly suitable for reflow and thermocompression processes.

The leveling between both components is adjusted before each bonding within 1 µradian. The parallelism adjustment, the high resolution alignment and the perfect control of all bonding parameters allow to achieve submicronic post-bond accuracy.

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SET – LDP150
The LDP150 is an electrical Press especially designed for bonding large light or radiation detectors (50 ~ 150mm). It uses compression process at room temperature (thermo-compression option available).

…
The LDP150 is an electrical Press especially designed for bonding large light or radiation detectors (50 ~ 150mm). It uses compression process at room temperature (thermo-compression option available).

A predefined gap can be achieved between two components previously pre-bonded using a high accuracy device bonder such as the SET FC150. The devices are pressed together at room temperature while preserving the initial high accuracy alignment and parallelism.

The LDP150 is able to apply pressure up to 100,000N.

Applications
- Large infrared focal plane arrays
- Military and space applications
- Large XY, UV detector
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SET – NEO HB
NEO HB is a flip-chip bonder designed for ± 1 µm @ 3σ accuracy in stand-alone or full automatic mode (EFEM). It is suitable for Hybrid/Direct bonding processes. NEO HB combines high precision, flexibility and short cycle time…
NEO HB is a flip-chip bonder designed for ± 1 µm @ 3σ accuracy in stand-alone or full automatic mode (EFEM). It is suitable for Hybrid/Direct bonding processes. NEO HB combines high precision, flexibility and short cycle time. It is dedicated for production.

Applications
- Hybrid / Direct bonding (room temperature)
- Flip-chip bonding, die bonding
- Chip-to-wafer, wafer level applications
- Chip-to-substrate bonding
- Pick & Place
- Memory stacking
- 3D IC
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SET – NPS300

Optimized for the production of nanostructures, the Nano imPrinting stepper Stepper NPS300 is the first ever tool able to combine Hot Embossing and UV-NIL on a same platform. The NPS300 is able to print sub-20 nm geometries with an overlay accuracy of 250 nm, when in-situ alignment is performed. Its flexible architecture offers an excellent process reproducibility and a unique ability to pattern large areas, in a sequential step and repeat mode on wafers up to 300 mm. It enables the low cost manufacturing of large stamps featuring repeated patterns.

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Seta – Advanced Fuel Ignition Delay Analyser (AFIDA)
Indicated Cetane Number Analysis

AFIDA is a revolutionary development providing fully automated determination of the Indicated Cetane Number (ICN) of diesel and diesel related fuels using test method IP 617.

Indicated Cetane Number Analysis

AFIDA is a revolutionary development providing fully automated determination of the Indicated Cetane Number (ICN) of diesel and diesel related fuels using test method IP 617.

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Seta – Air Release Value Apparatus
The Seta Air Release Value Apparatus is designed to determine the air release properties of hydrocarbon based oils in accordance with ASTM, IP and other methods.

The Seta Air Release Value Apparatus is designed to determine the air release properties of hydrocarbon based oils in accordance with ASTM, IP and other methods.

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Seta – Automatic Vapour Pressure Analyser – SetaVap 3
With a colour touch screen, the Setavap3 provides a clear user interface to guide the operator through the menu system and simple operator sequence. For precise results, the minimum dead volume design eliminates sample carryover…

With a colour touch screen, the Setavap3 provides a clear user interface to guide the operator through the menu system and simple operator sequence. For precise results, the minimum dead volume design eliminates sample carryover, it is suitable for high ethanol content fuels. A fully automated test sequence removes possible operator bias. Results are stored in a 16GB internal memory which can be viewed on the screen. For data management and analysis, results can be saved directly to a USB memory stick, LIMS compatibility and printing is provided via Ethernet or Serial Ports.

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Seta – FAME in Jet Instrument (FIJI)
IP 583 | ASTM D7797 – Determination of the fatty acid methyl esters (FAME) content of aviation turbine fuel (AVTUR) with fourier transform infrared spectroscopy (FTIR) – Rapid screening method.

IP 583 | ASTM D7797 – Determination of the fatty acid methyl esters (FAME) content of aviation turbine fuel (AVTUR) with fourier transform infrared spectroscopy (FTIR) – Rapid screening method.

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Seta – Flash Point Tester – Setaflash™ Series 3
Setaflash Series 3 has a very simple user interface with colour digital display and touch screen icons which guide the operator through a straightforward testing process. For easy record keeping the instrument stores 100,000 te…

Setaflash Series 3 has a very simple user interface with colour digital display and touch screen icons which guide the operator through a straightforward testing process. For easy record keeping the instrument stores 100,000 test results which can be saved and transferred via a USB port. The versatile range of Setaflash instruments is ideal for use in the laboratory, production line or for portable test applications.

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