The TSM N2 Reflow is a high-end reflow oven that provides precise temperature control for the most demanding soldering applications. It features a nitrogen atmosphere that minimizes oxidation and improves soldering quality, ensuring consistent and reliable results. With a compact design and intuitive user interface, the TSM N2 Reflow is a must-have for any electronics manufacturing facility looking to achieve the highest levels of quality and efficiency.

Key Features

• Realize Flux Zero in OVEN -> equip FMS applied with patent technology
• Thermal Interference Innovation in each zone -> Able to set up temperature difference with 60ºC in max. of interzone
• Internal Heat Reduction of Reflow -> apply New Emission System
• Real-time Monitoring,temperature Profile Monitoring and Oxygen Concentration Monitoring in each zone
• Conveyor Vibration Monitoring

L300 is the agile, perfect option for warehouses or manufacturing facilities with narrow passageways. Carrying a maximum payload of 300 kg, the AMR is equipped with a top module that elevates at a maximum height of 60mm and rotates at 360 degrees. The YOUIFLEET dispatching system allows a fleet collaboration of up to 1,000 AMRs under the same operation area, enabling a real light-out operation.