The Kardex Compact Buffer is a Vertical Buffer Module (VBM) that provides an efficient solution for fast-growing product ranges with limited storage space.

This scalable bin solution works as a mini-load system and flexibly stores, picks and buffers small parts. With the recently launched version, capable of extending up to 20 meters, the Kardex Compact Buffer provides valuable benefits. It allows companies to maximize space by utilizing the storage area at a minimal cost.

Pick small parts quickly and efficiently with the Kardex Compact Buffer (formerly LR 35)

To optimize order picking performance for small parts and lightweight goods, the Kardex Compact Buffer (formerly LR 35) is the ideal solution. Whether being used to supply a production line with a wide range of products; as buffer storage in the assembly area; or for picking slow-moving parts in the distribution warehouse, the Kardex Compact Buffer (formerly LR 35) significantly improves productivity, while guaranteeing accuracy and energy efficiency.

It is flexible and scalable. A work station can consist of one or more units. Companies benefit from optimal storage capacity and performance. They choose from several access opening types and can customize the unit dimensions up to 20 meters long and 12 meters high. This flexibility makes the Kardex Compact Buffer (formerly LR 35) an ideal solution for multiple applications. It easily integrates into existing processes and connects to different customer host-systems.

The importance of ergonomic picking is growing. Customers working with the Kardex Compact Buffer (formerly LR 35) benefit from ergonomic work stations, which simplify the picking process and improve overall working conditions. At each access opening, items tilt at a 20-degree angle while the goods-to-person principle delivers items directly to the operator, eliminating walk and search time.

A massive flat-rail and carriage module replaced the decades old round rail system. Chassis structure was heavily reinforced with interlocked walls and castings. Table drive is the servomotor system used on the DL-4A; with datum offset and home run features. Upgraded cutter motors and drive geometry give over 8000 max RPM at the spindle.

The NorCom 2020-WL inspects MEMS and other wafer level devices for both gross and fine leaks simultaneously while automatically rejecting all leaking devices. The system accepts up to an eight inch wafer that can be optionally loaded into the machine on saw frames measuring up to eleven inches square.  The equipment is easy to setup and use, and the results can be networked to an SPC system for tracking all devices tested. It is ideal for leak testing any wafer level device that has an internal cavity. The system can inspect up to 1000 devices per cycle in both the singulated and un-singulated states.

Next-generation and time-tested capabilities are combined in this upgraded system to increase productivity by up to 50% over the top-selling Spectrum® ll, all in a space-saving footprint. Improve UPH with swift acceleration, enhanced motion control, and IntelliJet® compatible Forte MAX dual-valve dispensing.

SPHERE series systems support automated handling and processing of round or square wafer/substrate sizes ranging from 75mm to 300mm. In addition, thin wafer processing with or without carriers is possible, depending upon wafer thickness.

The patented plasma chamber design provides exceptional etch uniformity and process repeatability. Primary plasma applications include a variety of etching, ashing, and descum steps. Other plasma processes include contamination removal, surface roughening, increasing wettability, and enhancing bonding and adhesion strength, photoresist/polymer stripping, dielectric etch, wafer bumping, organic contamination removal, and wafer destress.

• Wafer Cleaning – The SPHERE series plasma systems remove contamination prior to wafer bumping, remove organic contamination, remove fluorine and other halogen contamination, and remove metal and metal oxides. Plasma also improves spun-on film adhesion and cleans metallic bond pads.
• Wafer Etching – Plasma systems descum wafer of residual photoresist and BCB, pattern dielectric layers for redistribution, strip/etch photoresist, enhance adhesion of wafer applied materials, remove excess wafer applied mold /epoxy, enhance adhesion of gold solder bumps, destress wafer to reduce breakage, improve spun-on film adhesion, and clean aluminum bond pads.

This unit is used for loading of substrates, leadframes or carriers.

The NTA In-line Workstation is used to link between SMD machines or board handling units. It also allows manual assembly work to be carried out.

This unit is used for restacking of PCBs from the production line.