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Showing 25–48 of 86 results

ECD – Thermal Profiling – V-M.O.L.E.™ Series
The V-M.O.L.E.™ is a full-featured compact thermal profiler that belies its sophistication in an easy-to-use 3-channel Mini-thermocouple configuration. Ideal for VERIFICATION of PCB profile performance, 3 channels give you Hot…

The V-M.O.L.E.™ is a full-featured compact thermal profiler that belies its sophistication in an easy-to-use 3-channel Mini-thermocouple configuration. Ideal for VERIFICATION of PCB profile performance, 3 channels give you Hot, Cold and Sensitive component data for verifying the correct oven settings.

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Foxsign – Stereocirculatory Electrolysis Wet Blasting Deflash
FoxSign fully understands that our success is attributable to our customers and the society to which we all belong. As a global citizen, FoxSign is determined to make significant contributions to society various accessible proce…

FoxSign fully understands that our success is attributable to our customers and the society to which we all belong. As a global citizen, FoxSign is determined to make significant contributions to society various accessible process equipments through the experiences and technical abilities we already have.

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IDS – NanoJetTM Desktop
The NanoJet^TM Desktop printer is a complete printing solution mounted in a compact enclosure. The Desktop offers the following components.

The NanoJet^TM Desktop printer is a complete printing solution mounted in a compact enclosure. The Desktop offers the following components.

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IDS – NanoJetTM Free Standing Printer System
The NanoJet^TM FS system is a free-standing printer that provides a complete printing solution. The Free-standing System accepts g-code files and enables a user to perform various tasks ranging from circuit prototyping…

The NanoJet^TM FS system is a free-standing printer that provides a complete printing solution. The Free-standing System accepts g-code files and enables a user to perform various tasks ranging from circuit prototyping to production manufacturing.

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IDS – NanoJetTM Print Subsystems
The NanoJet^TM Subsystem is an economical print solution designed to be retrofitted to a pre-existing motion control module. The Subsystem uses the same Print Module as the (Full) FS System and Desktop systems and has …

The NanoJet^TM Subsystem is an economical print solution designed to be retrofitted to a pre-existing motion control module. The Subsystem uses the same Print Module as the (Full) FS System and Desktop systems and has the same printing capability.

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Kardex – Accessories
Keeping items and available space structured and organized minimizes search times and streamlines even the most complex work processes.

To achieve this, Kardex designed a wide range of special storage & transport boxes to meet every cu…

Keeping items and available space structured and organized minimizes search times and streamlines even the most complex work processes.

To achieve this, Kardex designed a wide range of special storage & transport boxes to meet every customer need.

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Kardex – Heavy Duty Units
Kardex In Association with Intertex.

The TowerMat and InterMat heavy-duty units are ideal solutions for companies that want to store oversized and extremely heavy goods in an efficient, safe, and compact manner.

Kardex In Association with Intertex.

The TowerMat and InterMat heavy-duty units are ideal solutions for companies that want to store oversized and extremely heavy goods in an efficient, safe, and compact manner.

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Kardex – Horizontal Carousel Module
Use the Horizontal Carousel Module (HCM) to store and retrieve goods quickly, reliably, and cost-effectively.

Use the Horizontal Carousel Module (HCM) to store and retrieve goods quickly, reliably, and cost-effectively.

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Kardex – Miniload-in-a-Box
The Kardex Miniload-in-a-Box* is part of the product family Vertical Buffer Module (VBM) and provides solutions for fast-growing product ranges with limited storage space. The system uses a lightweight mini-load crane with a telescopic gripper to …

The Kardex Miniload-in-a-Box* is part of the product family Vertical Buffer Module (VBM) and provides solutions for fast-growing product ranges with limited storage space. The system uses a lightweight mini-load crane with a telescopic gripper to individually transport bins or trays to the access opening point.

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Kardex – Software and Control Solutions
Efficient and reliable warehouse management software solutions are as important for the productivity of modern warehouses as hardware components.

Efficient and reliable warehouse management software solutions are as important for the productivity of modern warehouses as hardware components.

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Kardex – Vertical Buffer Module
The Kardex Compact Buffer is a Vertical Buffer Module (VBM) that provides an efficient solution for fast-growing product ranges with limited storage space.

This scalable bin solution works as a mini-load system and flexibly stores, picks an…

The Kardex Compact Buffer is a Vertical Buffer Module (VBM) that provides an efficient solution for fast-growing product ranges with limited storage space.

This scalable bin solution works as a mini-load system and flexibly stores, picks and buffers small parts. With the recently launched version, capable of extending up to 20 meters, the Kardex Compact Buffer provides valuable benefits. It allows companies to maximize space by utilizing the storage area at a minimal cost.

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Kardex – Vertical Carousel Module
The new Kardex Megamat is an automated carousel which rotates vertically around a track to bring stored inventory to an operator.

The new Kardex Megamat is an automated carousel which rotates vertically around a track to bring stored inventory to an operator.

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Kardex – Vertical Lift Module
The Vertical Lift Module (VLM) from Kardex features an enclosed shelf-based storage system designed to increase capacity in a more compact footprint.

The Vertical Lift Module (VLM) from Kardex features an enclosed shelf-based storage system designed to increase capacity in a more compact footprint.

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Kardex – Office Solution Kardex Megamat 115 / 120 (Formerly Lektriever)
The Kardex Megamat 115 / 120 (formerly Lektriever) is a software-controlled automated media storage and retrieval system that holds thousands of media files, videos, CDs, DVDs, or a host of other media.

The Kardex Megamat 115 / 120 (formerly Lektriever) is a software-controlled automated media storage and retrieval system that holds thousands of media files, videos, CDs, DVDs, or a host of other media.

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Koolance – Liquid Coolant
Liquid coolants are not only intended to facilitate heat transfer but also to avoid corrosion and biological growth risk. Koolance coolants are designed to prevent clogging of components…

Liquid coolants are not only intended to facilitate heat transfer but also to avoid corrosion and biological growth risk. Koolance coolants are designed to prevent clogging of components and generally last 2-3 years before replacement is recommended. (Shelf-life is 3 years.) They are available in 702 and 705 series, offered in bottles or 700 ml containers.

The 702 series coolant is ideal for industries that require high-performance, low-toxicity, and reliable coolant with effective corrosion and biological inhibitors. High-quality coolant is essential for long-term management of dissimilar metals and biological growth, including bacteria and algae.

The 705 series coolant is widely used in industries that require low conductivity (3 microSiemens per centimeter), low-toxicity, and reliable coolant with corrosion and biological inhibitors. Like the 702 series, it offers long-term protection against dissimilar metals and biological growth.

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Midas – D5 Series de-idder™
A massive flat-rail and carriage module replaced the decades old round rail system. Chassis structure was heavily reinforced with interlocked walls and castings. Table drive is the servomotor system used on the DL-4A; with datum…

A massive flat-rail and carriage module replaced the decades old round rail system. Chassis structure was heavily reinforced with interlocked walls and castings. Table drive is the servomotor system used on the DL-4A; with datum offset and home run features. Upgraded cutter motors and drive geometry give over 8000 max RPM at the spindle.

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Midas – Hot Gas Rework System

The HGRS-1J

The HGRS-1J is a compact, economical single-jet tool giving high temp performance without “the extras”. This is a great solution for specific applications (thermal test, fiber attach, small die removal) and for labs needing more thermal performance than air heaters can provide.

The HGRS-V is a highly adaptable dual-jet “thermal workbench” with a comprehensive suite of circuit-protective features. It’s the ideal solution for those facing a variety of rework tasks involving large die, eutectic attach, double-sided devices or other assemblies with tight thermal constraints.

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NorCom – Optical Leak Test System – NorCom 2020
The NorCom 2020 provides automated in line, full matrix leak testing of hermetically sealed microelectronic and optoelectronic devices. It eliminates the need for helium mass spectroscopy and gross leak bubble testing by utilizi…
The NorCom 2020 provides automated in line, full matrix leak testing of hermetically sealed microelectronic and optoelectronic devices. It eliminates the need for helium mass spectroscopy and gross leak bubble testing by utilizing a patented laser interferometer to simultaneously measure gross and fine leaks in hermetic devices.

Since the reliability of hermetic electronic packages is dependent on the detection of gross and fine leaks, the NorCom 2020’s pinpoint accuracy, repeatability and increased production throughput make the system an essential requirement for hermetic device production.

Key Features
- High Throughput
- Automatic In-line Leak Detection
- Clean and Safe Procedure
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Norcom 2020-WL
The NorCom 2020-WL inspects MEMS and other wafer level devices for both gross and fine leaks simultaneously while automatically rejecting all leaking devices. The system accepts up to an eight inch wafer that can be optionally loaded into the mach…

The NorCom 2020-WL inspects MEMS and other wafer level devices for both gross and fine leaks simultaneously while automatically rejecting all leaking devices. The system accepts up to an eight inch wafer that can be optionally loaded into the machine on saw frames measuring up to eleven inches square. The equipment is easy to setup and use, and the results can be networked to an SPC system for tracking all devices tested. It is ideal for leak testing any wafer level device that has an internal cavity. The system can inspect up to 1000 devices per cycle in both the singulated and un-singulated states.

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Nordson EFD – HPx High-Pressure Dispensing Tool
HPx High-Pressure Dispensing Tool easily apply precise amounts of thick assembly fluids like epoxies and medical-grade adhesives through dispense tips as small as 0.004” with Nordson EFD HPx™ dispensing tools. Featuring a unique design, HPx to…

HPx High-Pressure Dispensing Tool easily apply precise amounts of thick assembly fluids like epoxies and medical-grade adhesives through dispense tips as small as 0.004” with Nordson EFD HPx™ dispensing tools. Featuring a unique design, HPx tools increase the pressure inside disposable syringe barrels up to seven times.

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Nordson Electronics Solutions – Asymtek Forte^® Series
Next-generation and time-tested capabilities are combined in this upgraded system to increase productivity by up to 50% over the top-selling Spectrum^® ll, all in a space-saving footprint.

Next-generation and time-tested capabilities are combined in this upgraded system to increase productivity by up to 50% over the top-selling Spectrum^® ll, all in a space-saving footprint.

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Nordson Electronics Solutions – Automated Plasma Treatment System – FlexTRAK® SHS
Industry-Leading Throughput and Reliability

Built upon Nordson Electronics Solutions’ patented plasma technology, the FlexTRAK®-SHS is our latest fully automated plasma system incorporating a high-capacity F3-S chamber, to provide …
Industry-Leading Throughput and Reliability

Built upon Nordson Electronics Solutions’ patented plasma technology, the FlexTRAK®-SHS is our latest fully automated plasma system incorporating a high-capacity F3-S chamber, to provide high uniformity and increased productivity. The chamber architecture remains the same as the smaller FlexTRAK platform, providing a seamless transition between chambers as production demands more capacity.

Key Applications
- Pre-wire bond plasma treatment on semiconductor package substrates and lead frames
- Pre-underfill plasma treatment on flip chip packages
- Pre-mold plasma treatment on semiconductor package substrates and lead frames
- Plasma treatment of semiconductor package substrates and lead frames for improved adhesion
- Removal/reduction of oxidation on lead frame
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Nordson Electronics Solutions – Plasma Polymerization Deposition System – PD Series
Nordson Electronics Solutions introduces its PD Series Plasma Deposition Systems family, which uses plasma polymerization to deposit thin films uniformly during precision manufacturing and assembly processes to change the surfac…
Nordson Electronics Solutions introduces its PD Series Plasma Deposition Systems family, which uses plasma polymerization to deposit thin films uniformly during precision manufacturing and assembly processes to change the surface characteristics of a substrate. Plasma deposition can be used for applications in a wide range of industries, including medical, life sciences, industrial, semiconductor, MEMS, plastics, and electronics.

The PD Series for plasma deposition uses a gas vapor or heated liquid monomer vapor delivery system to deposit coatings that can reduce, and in certain cases eliminate, tackiness, provide a tie layer, make surfaces more slippery or resistant to corrosion, act as a drug enhancement or inhibition agent in life sciences applications, and change desired surfaces from hydrophobic to hydrophilic or vice versa. Polymers can be directly attached to a desired surface while the chains are growing, which reduces the steps necessary for other coating processes such as grafting. This is very useful for pinhole-free coatings of 100 picometers to 1 micrometer thickness with solvent insoluble polymers.

Key Features
- Low-temperature processing because plasma energy is the catalyst for film growth.
- Plasma deposition is uniform and applies coatings evenly over curved or varied-level surfaces.
- Precise control of film thickness.
- Eliminates wet chemistry. Because polymers are deposited directly from the monomer, there are no waste streams due to wet chemical synthesis or solvents.
- Exhibits similar properties to those created via standard chemical polymerization techniques.
- Can be used in multiple steps during device manufacture: pre-treat the surface, deposit material, and apply functionalized polymer films.
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Nordson Electronics Solutions – Plasma Systems – Sphere Series
SPHERE series systems support automated handling and processing of round or square wafer/substrate sizes ranging from 75mm to 300mm. In addition, thin wafer processing with or without carriers is possible, depending upon wafer t…
SPHERE series systems support automated handling and processing of round or square wafer/substrate sizes ranging from 75mm to 300mm. In addition, thin wafer processing with or without carriers is possible, depending upon wafer thickness.

The patented plasma chamber design provides exceptional etch uniformity and process repeatability. Primary plasma applications include a variety of etching, ashing, and descum steps. Other plasma processes include contamination removal, surface roughening, increasing wettability, and enhancing bonding and adhesion strength, photoresist/polymer stripping, dielectric etch, wafer bumping, organic contamination removal, and wafer destress.
- Wafer Cleaning – The SPHERE series plasma systems remove contamination prior to wafer bumping, remove organic contamination, remove fluorine and other halogen contamination, and remove metal and metal oxides. Plasma also improves spun-on film adhesion and cleans metallic bond pads.
- Wafer Etching – Plasma systems descum wafer of residual photoresist and BCB, pattern dielectric layers for redistribution, strip/etch photoresist, enhance adhesion of wafer applied materials, remove excess wafer applied mold /epoxy, enhance adhesion of gold solder bumps, destress wafer to reduce breakage, improve spun-on film adhesion, and clean aluminum bond pads.
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