HANMI Semiconductor

About HANMI Semiconductor

Founded in 1980 to support the development of Korea’s semiconductor industry, Hanmi Semiconductor has grown steadily into a world-class semiconductor equipment manufacturer. Now, HANMI is a leading designer, developer, and manufacturer in the semiconductor equipment industry, equipped with the best assembly systems, efficient production processes, continuous R&D investment, and high-tech modules—built through 25 years of quality improvement.

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Products

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  • HANMI – 3D Vision Inspection

    HANMI – 3D Vision Inspection

    HANMI 3D VISION INSPECTION is designed with the latest innovations in vision PIMP technology and field proven handler reliability for all types of packages to meet customers’ needs high productivity, precise inspection, high accuracy, variou…

    HANMI 3D VISION INSPECTION is designed with the latest innovations in vision PIMP technology and field proven handler reliability for all types of packages to meet customers’ needs high productivity, precise inspection, high accuracy, various inspection items, intelligent reject sorting function, easy-to-use user interface and quick change-over.

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  • HANMI – Bonder

    HANMI – Bonder

    Maximize degree of precision and durability with minimizes vibration by applying super iron casting.

    Maximize degree of precision and durability with minimizes vibration by applying super iron casting.

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  • HANMI – EMI Shield Equipment

    HANMI – EMI Shield Equipment

    Electromagnetic interference (EMI) shielding equipment is used to deposit stainless materials and copper onto the surface of semiconductors so that the chip shields EMI interference avoiding malfunction and assuring smooth operation with other chi…

    Electromagnetic interference (EMI) shielding equipment is used to deposit stainless materials and copper onto the surface of semiconductors so that the chip shields EMI interference avoiding malfunction and assuring smooth operation with other chips.

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  • HANMI – Meta Grinder

    HANMI – Meta Grinder

    Particularly vital in the production of 3D packages and devices used in virtual and augmented reality (VR/AR) applications.

    Particularly vital in the production of 3D packages and devices used in virtual and augmented reality (VR/AR) applications.

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  • HANMI – micro SAW P2101 & Vision Placement 8.0PS

    HANMI – micro SAW P2101 & Vision Placement 8.0PS

    The micro SAW P2101 was developed as a package singulation saw intended for customers needing to singulate their packages, such as BGA’s, QFN’s, MAP’s, etc., from strips.

    The micro SAW P2101 was developed as a package singulation saw intended for customers needing to singulate their packages, such as BGA’s, QFN’s, MAP’s, etc., from strips.

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  • HANMI – TC Bonder

    HANMI – TC Bonder

    TC Bonders bond individual chips on processed wafers, are in increasing demand driven by the introduction of high-bandwidth memory (HBM) and DDR5.

    TC Bonders bond individual chips on processed wafers, are in increasing demand driven by the introduction of high-bandwidth memory (HBM) and DDR5.

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  • HANMI – Vision Placement Conversion Kit

    HANMI – Vision Placement Conversion Kit

    HANMI’s Vision Placement Conversion Kit is for best quality and performance.

    HANMI’s Vision Placement Conversion Kit is for best quality and performance.

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