ATV Technologie Gmbh

This reliable Diamond Scriber performs fast, easy and precise scribing and cutting of silicon wafers, as well as thin and thick film ceramic and glass substraits. It forms the grooves necessary for effective glass or ceramic cutting: shallow, even and continuous. All essential operating parameters – the angle of the scribing tool, the scribing force, the touchdown point and the lift up point of the tool are precisely adjustable to ensure optimal felxibility and repeatable results.

Key Features

• Fast and easy operation
• No maintenance
• Multipurpose diamond tool with 4 cutting edges
• Adjustable scribing force
• Adjustable substrate thickness
• Precise step and repeat by adjustable
• Mechanical stop with angular adjustmen
• Roller blade for glass (option)

ATV’s successful SRO-71X series IR vacuum reflow oven is the heart of ATV’s reflow soldering principle. Our ATV-TCB, Thermal Compression Bonding is also based on which this system is developed. The Single Cold Wall Process Chamber approach is a standard on itself and is also applied for the ATV-TCB which fulfills all your process requirements.

Our Thermal Compression Bonding system has an isostatic press in combination with an elastomer membrane. This patented technology gives you the opportunity to use a maximum pressing force of 0,5MPa over 150 mm Ø. This pressure can be gradually built up to the desired process pressure under which you want to perform your process. With our applied membrane technology you will not be faced with product shifting from start to finish. Another advantage for our technology is that you may process simultaneously products which have a different topography. This will have no influence on the expected final process results.

Also in this tool ATV uses all its know-how of the cold wall technology in combination with the IR heating concept, vacuum assembly as well as formic acid atmosphere to achieve the prefect solder joints you need for a reliable product. Working with the ATV-TCB you will notice that programming is easy and with the 100 step programming steps you will be able to fine tune your process in such a way that a process success is guaranteed.

The all-new and groundbreaking SRO i-Line is a high volume production tool used for vacuum reflow soldering. Implementing this tool within the ATV single chamber approach will help to fulfil all your current and future demands. Since 1982 ATV‘s single chamber approach has proven equally successful in the R&D and pilot line production market.

With more than 550 devices in use worldwide ATV is ready to step into high volume production with its brand-new SRO i-Line. This system can easily be upgraded from the basic one process chamber version to three process chambers all within the same footprint. Each chamber is individually programmable to perform its own process. This allows for the most flexible solution within your production.

Key Features

• High Throughput
• Short Cycle Times
• Formic Acid
• Process Temperature Up To 450°c Temperature Ramp-up Rate 3k/sec.
• Temperature Cool-down Rate 2k/sec.
• Excellent Temperature Uniformity
• IR Heating
• Small Footprint (No Footprint Change Up To 3 Process Chambers)

This table top soldering system is the ideal tool for R&D applications. With its rapid thermal annealing and brazing capabilities the SRO-700 is equally suited for your basic reflow soldering applications as well as all your R&D assignments. A cold wall chamber principle in combination with the IR lamp heating technology and the vacuum option will reward you with all the required process repeatability and perfect void free solder joints.

With its 100 mm clearance over the heated surface the system can handle products like IGBT and power electronics packages. The SRO-700 is an incredibly versatile reflow oven for semiconductor and MEMS application. Whatever the objective the SRO-700 is ready to handle it all.

Key Features

• Formic Acid Enriched Atmosphere
• Direct IR Heating
• Multiple TC monitoring
• Process temperature 450°C
• Oxygen < 1,0ppm with PURIFIED N2
• 100 steps/RECIPE program

ATV’s approach using the Cold Wall Process Chamber is also applied in the SRO-706 Getter system. This system can be applied for Thermal Getter processes in R&D and Production line applications. The basis for the Getter system is the successful SRO-706 series IR vacuum reflow oven. Common applications are sealing of packages with kovar caps or optical windows for gyroscopes, microbolometer and various MEMS sensors under high vacuum by applying thermal Getter activation.

With its proven direct IR heating approach, ATV applies for the SRO-706 Getter system a top and bottom heating. The IR lamp arrays are independently monitored and controlled as 2 separate heating zones. This results that there is an excellent heating uniformity under vacuum when reaching a maximum temperature of 450°C during the Thermal getter process. The sensor or chip temperature remains below 100°C during the getter activation process. Optionally, a mass spectrometer can be added for residual gas analysis during the sealing process.

The SRO-706 Getter is a result of in-depth cooperation with our customer base and listing to the needs of the market as you may expect form ATV.

Key Features

• Programmable solder reflow oven
• Thermal reactor
• High vacuum package lid sealing system
• Thermal getter activation

The ATV SRO-716 series standalone IR vacuum reflow ovens are the benchmark for R&D, low volume pilot line and medium volume batch production. The system produces high quality results with outstanding process stability and repeatability. Configuration dependent, process capabilities include: flux-less soldering, eutectic die attach, gold tin soldering, void-free soldering, hermetic lid sealing, formic acid processing and flip chip soldering etc.

Key Features

• Small Footprint, Freestanding Vacuum Reflow Oven
• Touch TCs with Quick Swap Hotplates
• Maximum Temperature 450°C, (optional 700°C)
• Temperature ramp-up rate 3.5K/sec
• Up to 100 process steps per profile recipe
• Automatic Chamber Opening / Closing
• Optional Top Heating
• Heated Area: 314 x 314 mm
• Oxygen < 1 ppm
• Optional High-Pressure Atmosphere: up to 3 bar (abs)
• Formic Acid, H2 or Solder Paste Activation